FPGA Market

XC3S50A-4FT256I

AMD Xilinx Spartan-3 FPGA

2K logic cells 256-ball Industrial

AvailableLifecycle: End of LifeNotice: XCN23009

The XC3S50A-4FT256I is an AMD Xilinx Spartan-3 FPGA based on the XC3S50A device, with 1,584 logic cells and 54 Kb of block RAM. It comes in the FT256 package (256-FTBGA, 17 × 17 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). The manufacturer has announced end of life for this part. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
1,584
Block RAM
54 Kb
Pins
256
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S50A-4FT256I
Base device
XC3S50A
Family
Spartan-3
Package
FT256
Pin / ball count
256
Speed grade
4
Temperature grade
Industrial
Product status
End of Life
Manufacturer notice
XCN23009
ECCN
EAR99
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
1,584
Block RAM
54 Kb

Specifications

Package outline
256-FTBGA, 17 × 17 mm
Package / case
256-LBGA
Mounting
Surface Mount
User I/O
144
LABs / CLBs
176
System gates
50,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3A
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S50ABase DeviceSpartan-3 device XC3S50A
4Speed GradeSpeed grade 4
FT256Package256-pin BGA (thin fine-pitch ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S50A-4FT256CSame device, commercial temperatureFT256-4Commercial
XC3S50A-4FTG256CSame device, different packageFTG256-4Commercial
XC3S50A-4FTG256ISame device, different packageFTG256-4Industrial
XC3S50A-5FTG256CSame device, different packageFTG256-5Commercial
XC3S50A-4TQ144CSame device, different packageTQ144-4Commercial
XC3S50A-4TQ144ISame device, different packageTQ144-4Industrial
XC3S50A-4TQG144CSame device, different packageTQG144-4Commercial
XC3S50A-4TQG144ISame device, different packageTQG144-4Industrial
XC3S50A-5TQG144CSame device, different packageTQG144-5Commercial
XC3S50A-4VQ100CSame device, different packageVQ100-4Commercial
XC3S50A-4VQ100ISame device, different packageVQ100-4Industrial
XC3S50A-4VQG100CSame device, different packageVQG100-4Commercial
XC3S50A-4VQG100ISame device, different packageVQG100-4Industrial
XC3S50A-5VQG100CSame device, different packageVQG100-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S50A-4FT256I still in production?
The manufacturer has announced end of life for the XC3S50A-4FT256I. Request a quote to check remaining stock — send the quantity you need.
Is there a direct replacement for the XC3S50A-4FT256I?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S50A-4FT256I. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S50A-4FT256I?
The XC3S50A-4FT256I comes in the FT256 package (256-FTBGA, 17 × 17 mm).
Which versions of the XC3S50A come in industrial temperature?
The XC3S50A-4FT256I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC3S50A parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S50A-4FTG256IXC3S50A-4TQ144IXC3S50A-4TQG144IXC3S50A-4VQ100IXC3S50A-4VQG100I

XC3S50A discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S50A replacement options

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