FPGA Market

Obsolete device

XC3S50A replacement options

The AMD Xilinx XC3S50A has been declared end of life by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 9 XC3S50A parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

From the manufacturer's discontinuation notice: Product Discontinuation Notice for XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II,

1. Keep the design — source the XC3S50A

Discontinued parts are still traded. We hold 15 orderable XC3S50A parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XC3S50A-4FT256CFT2562564Commercial
XC3S50A-4FT256IFT2562564Industrial
XC3S50A-4FTG256CFTG2562564Commercial
XC3S50A-4FTG256IFTG2562564Industrial
XC3S50A-5FTG256CFTG2562565Commercial
XC3S50A-4TQ144CTQ1441444Commercial
XC3S50A-4TQ144ITQ1441444Industrial
XC3S50A-4TQG144CTQG1441444Commercial
XC3S50A-4TQG144ITQG1441444Industrial
XC3S50A-5TQG144CTQG1441445Commercial
XC3S50A-4VQ100CVQ1001004Commercial
XC3S50A-4VQ100IVQ1001004Industrial
XC3S50A-4VQG100CVQG1001004Commercial
XC3S50A-4VQG100IVQG1001004Industrial
XC3S50A-5VQG100CVQG1001005Commercial

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XC3S50A, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XC3S50ABlock RAMDSPParts
XC3S50ASpartan-31,584The original54 Kb15
XC7S6Spartan-76,0003.8× the logic cells180 Kb1014
XA7S6Spartan-76,0003.8× the logic cells180 Kb102

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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