XC3S1400AN-5FGG676C
AMD Xilinx Spartan-3 FPGA
25K logic cells 676-ball Commercial
The XC3S1400AN-5FGG676C is an AMD Xilinx Spartan-3 FPGA based on the XC3S1400AN device, with 25,344 logic cells and 576 Kb of block RAM. It comes in the FGG676 package (676-FBGA, 27 × 27 mm), speed grade 5, commercial temperature (0 °C to 85 °C, junction). The manufacturer has announced end of life for this part. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 25,344
- Block RAM
- 576 Kb
- Pins
- 676
- Speed grade
- 5
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S1400AN-5FGG676C
- Base device
- XC3S1400AN
- Family
- Spartan-3
- Package
- FGG676
- Pin / ball count
- 676
- Speed grade
- 5
- Temperature grade
- Commercial
- Product status
- End of Life
- Manufacturer notice
- XCN23009
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic cells
- 25,344
- Block RAM
- 576 Kb
Specifications
- Package outline
- 676-FBGA, 27 × 27 mm
- Package / case
- 676-BGA
- Mounting
- Surface Mount
- User I/O
- 502
- LABs / CLBs
- 2,816
- System gates
- 1,400,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Spartan-3AN
- Last time buy
- 29 Jun 2024
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S1400AN | Base Device | Spartan-3 device XC3S1400AN |
| 5 | Speed Grade | Speed grade 5 |
| FGG676 | Package | 676-pin BGA (fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S1400AN-4FGG484C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S1400AN-4FG484C | Same device, different package | FG484 | -4 | Commercial |
| XC3S1400AN-4FG484I | Same device, different package | FG484 | -4 | Industrial |
| XC3S1400AN-5FG484C | Same device, different package | FG484 | -5 | Commercial |
| XC3S1400AN-4FG676C | Same device, different package | FG676 | -4 | Commercial |
| XC3S1400AN-4FG676I | Same device, different package | FG676 | -4 | Industrial |
| XC3S1400AN-4FGG484C | Same device, different package | FGG484 | -4 | Commercial |
| XC3S1400AN-4FGG484I | Same device, different package | FGG484 | -4 | Industrial |
| XC3S1400AN-5FGG484C | Same device, different package | FGG484 | -5 | Commercial |
| XC3S1400AN-4FGG676C | Same device, different speed grade | FGG676 | -4 | Commercial |
| XC3S1400AN-4FGG676I | Same device, different speed and temperature grade | FGG676 | -4 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC3S1400AN-5FGG676C still in production?
- The manufacturer has announced end of life for the XC3S1400AN-5FGG676C. Request a quote to check remaining stock — send the quantity you need.
- Is there a direct replacement for the XC3S1400AN-5FGG676C?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S1400AN-5FGG676C. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XC3S1400AN-5FGG676C?
- The XC3S1400AN-5FGG676C comes in the FGG676 package (676-FBGA, 27 × 27 mm).
- Which versions of the XC3S1400AN come in industrial temperature?
- The XC3S1400AN-5FGG676C is not an industrial-temperature part. 4 XC3S1400AN parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S1400AN-4FGG676IXC3S1400AN-4FG484IXC3S1400AN-4FG676IXC3S1400AN-4FGG484I
XC3S1400AN discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S1400AN replacement optionsGuides and comparisons
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