XC3S1400AN-4FGG484C
AMD Xilinx Spartan-3 FPGA
25K logic cells 484-ball Commercial
The XC3S1400AN-4FGG484C is an AMD Xilinx Spartan-3 FPGA based on the XC3S1400AN device, with 25,344 logic cells and 576 Kb of block RAM. It comes in the FGG484 package (484-FBGA, 23 × 23 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction). The manufacturer has announced end of life for this part. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 25,344
- Block RAM
- 576 Kb
- Pins
- 484
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S1400AN-4FGG484C
- Base device
- XC3S1400AN
- Family
- Spartan-3
- Package
- FGG484
- Pin / ball count
- 484
- Speed grade
- 4
- Temperature grade
- Commercial
- Product status
- End of Life
Device specifications
- Logic cells
- 25,344
- Block RAM
- 576 Kb
Specifications
- Package outline
- 484-FBGA, 23 × 23 mm
- Package / case
- 484-BBGA
- Mounting
- Surface Mount
- User I/O
- 372
- LABs / CLBs
- 2,816
- System gates
- 1,400,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S1400AN | Base Device | Spartan-3 device XC3S1400AN |
| 4 | Speed Grade | Speed grade 4 |
| FGG484 | Package | 484-pin BGA (fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S1400AN-4FGG484C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S1400AN-4FG484C | Same device, different package | FG484 | -4 | Commercial |
| XC3S1400AN-4FG484I | Same device, different package | FG484 | -4 | Industrial |
| XC3S1400AN-5FG484C | Same device, different package | FG484 | -5 | Commercial |
| XC3S1400AN-4FG676C | Same device, different package | FG676 | -4 | Commercial |
| XC3S1400AN-4FG676I | Same device, different package | FG676 | -4 | Industrial |
| XC3S1400AN-4FGG484I | Same device, industrial temperature | FGG484 | -4 | Industrial |
| XC3S1400AN-5FGG484C | Same device, different speed grade | FGG484 | -5 | Commercial |
| XC3S1400AN-4FGG676C | Same device, different package | FGG676 | -4 | Commercial |
| XC3S1400AN-4FGG676I | Same device, different package | FGG676 | -4 | Industrial |
| XC3S1400AN-5FGG676C | Same device, different package | FGG676 | -5 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC3S1400AN-4FGG484C still in production?
- The manufacturer has announced end of life for the XC3S1400AN-4FGG484C. Request a quote to check remaining stock — send the quantity you need.
- What package is the XC3S1400AN-4FGG484C?
- The XC3S1400AN-4FGG484C comes in the FGG484 package (484-FBGA, 23 × 23 mm).
- Which versions of the XC3S1400AN come in industrial temperature?
- The XC3S1400AN-4FGG484C is not an industrial-temperature part. 4 XC3S1400AN parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S1400AN-4FGG484IXC3S1400AN-4FG484IXC3S1400AN-4FG676IXC3S1400AN-4FGG676I
XC3S1400AN discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S1400AN replacement optionsGuides and comparisons
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