FPGA Market

XAZU4EV-1SFVC784Q

AMD Xilinx Zynq UltraScale+ MPSoC FPGA

192K logic cells 784-ball BGA Automotive

Available

The XAZU4EV-1SFVC784Q is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XAZU4EV device, with 192,150 logic cells, 4,608 Kb of block RAM and 728 DSP slices. It comes in the SFVC784 package (784-FCBGA, 23 × 23 mm), speed grade 1, automotive temperature (-40 °C to 125 °C, junction). It runs from a 0.85 V core supply (VCCINT).

Logic cells
192,150
Block RAM
4,608 Kb
DSP slices
728
Balls
784
Speed grade
1
Temperature
Automotive

Part details

Manufacturer
AMD Xilinx
Part number
XAZU4EV-1SFVC784Q
Base device
XAZU4EV
Family
Zynq UltraScale+ MPSoC
Package
SFVC784
Package type
BGA
Pin / ball count
784
Speed grade
1
Temperature grade
Automotive
Core supply (VCCINT)
0.85 V

Device specifications

Logic cells
192,150
DSP slices
728
Block RAM
4,608 Kb
LUTs
87,840
Flip-flops
175,680
Block RAM blocks (36 Kb)
128
Distributed RAM
2.6 Mb
UltraRAM
13.5 Mb
Clock management tiles
4

Specifications

Package outline
784-FCBGA, 23 × 23 mm
Package / case
784-BFBGA, FCBGA
FPGA fabric
ZynqUltraScale+ FPGA, 192K+ Logic Cells
Architecture
MCU, FPGA
Processor RAM
256 KB
Speed
500 MHz, 600 MHz, 1.2 GHz
Processor core
Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2
Interfaces
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Operating temperature
-40 °C to 125 °C (junction)

Part number breakdown

SegmentFieldMeaning
XAZU4EVBase DeviceZynq UltraScale+ MPSoC device XAZU4EV
1Speed GradeSpeed grade 1
SFVC784Package784-pin BGA (flip-chip ball grid array)
QTemperature GradeAutomotive Q-grade

Documentation

Frequently asked questions

What package is the XAZU4EV-1SFVC784Q?
The XAZU4EV-1SFVC784Q comes in the SFVC784 BGA package (784-FCBGA, 23 × 23 mm).

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