XAZU3EG-1SFVC784Q
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
154K logic cells 784-ball BGA Automotive
AvailableLifecycle: Active
The XAZU3EG-1SFVC784Q is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XAZU3EG device, with 154,350 logic cells, 7,776 Kb of block RAM and 360 DSP slices. It comes in the SFVC784 package (784-FCBGA, 23 × 23 mm), speed grade 1, automotive temperature (-40 °C to 125 °C, junction). It runs from a 0.85 V core supply (VCCINT). It is in active production.
- Logic cells
- 154,350
- Block RAM
- 7,776 Kb
- DSP slices
- 360
- Balls
- 784
- Speed grade
- 1
- Temperature
- Automotive
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XAZU3EG-1SFVC784Q
- Base device
- XAZU3EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- SFVC784
- Package type
- BGA
- Pin / ball count
- 784
- Speed grade
- 1
- Temperature grade
- Automotive
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A002A4 XIL
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- Logic cells
- 154,350
- DSP slices
- 360
- Block RAM
- 7,776 Kb
- LUTs
- 70,560
- Flip-flops
- 141,120
- Block RAM blocks (36 Kb)
- 216
- Distributed RAM
- 1.8 Mb
- Clock management tiles
- 3
Specifications
- Package outline
- 784-FCBGA, 23 × 23 mm
- Package / case
- 784-BFBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 154K+ Logic Cells
- Architecture
- MPU, FPGA
- Processor RAM
- 1.8 MB
- Speed
- 500 MHz, 1.2 GHz
- Processor core
- Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2
- Interfaces
- CANbus, I2C, SPI, UART/USART, USB
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 125 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EG
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XAZU3EG | Base Device | Zynq UltraScale+ MPSoC device XAZU3EG |
| 1 | Speed Grade | Speed grade 1 |
| SFVC784 | Package | 784-pin BGA (flip-chip ball grid array) |
| Q | Temperature Grade | Automotive Q-grade |
Documentation
- XAZU3EG-1SFVA625Q datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XAZU3EG-1SFVA625I | Same device, different package | SFVA625 | -1 | Industrial |
| XAZU3EG-1SFVA625Q | Same device, different package | SFVA625 | -1 | Automotive |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XAZU3EG-1SFVC784Q still in production?
- Yes. The XAZU3EG-1SFVC784Q is in active production.
- What package is the XAZU3EG-1SFVC784Q?
- The XAZU3EG-1SFVC784Q comes in the SFVC784 BGA package (784-FCBGA, 23 × 23 mm).
- Which versions of the XAZU3EG come in industrial temperature?
- The XAZU3EG-1SFVC784Q is an automotive-temperature part (-40 °C to 125 °C, junction), a wider range than industrial. One other XAZU3EG part is industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XAZU3EG-1SFVA625I
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