FPGA Market

XA3SD3400A-4FGG676I

AMD Xilinx Spartan-3 FPGA

54K logic cells 676-ball Industrial

Available

The XA3SD3400A-4FGG676I is an AMD Xilinx Spartan-3 FPGA based on the XA3SD3400A device, with 53,712 logic cells and 2,268 Kb of block RAM. It comes in the FGG676 package (676-FBGA, 27 × 27 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). It is qualified to AEC-Q100.

Logic cells
53,712
Block RAM
2,268 Kb
Pins
676
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XA3SD3400A-4FGG676I
Base device
XA3SD3400A
Family
Spartan-3
Package
FGG676
Pin / ball count
676
Speed grade
4
Temperature grade
Industrial
Qualification
AEC-Q100

Device specifications

Logic cells
53,712
Block RAM
2,268 Kb

Specifications

Package outline
676-FBGA, 27 × 27 mm
Package / case
676-BGA
Mounting
Surface Mount
User I/O
469
LABs / CLBs
5,968
System gates
3,400,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Grade
Automotive

Part number breakdown

SegmentFieldMeaning
XA3SD3400ABase DeviceSpartan-3 device XA3SD3400A
4Speed GradeSpeed grade 4
FGG676Package676-pin BGA (fine-pitch ball grid array, Pb-free)
ITemperature GradeIndustrial

Documentation

Frequently asked questions

What package is the XA3SD3400A-4FGG676I?
The XA3SD3400A-4FGG676I comes in the FGG676 package (676-FBGA, 27 × 27 mm).
Which versions of the XA3SD3400A come in industrial temperature?
The XA3SD3400A-4FGG676I is itself an industrial-temperature part (-40 °C to 100 °C, junction).

XA3SD3400A discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XA3SD3400A replacement options

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