FPGA Market

Obsolete device

XA3SD3400A replacement options

The AMD Xilinx XA3SD3400A has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

1. Keep the design — source the XA3SD3400A

Discontinued parts are still traded. We hold 2 orderable XA3SD3400A parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XA3SD3400A-4CSG484ICSG4844844Industrial
XA3SD3400A-4FGG676IFGG6766764Industrial

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XA3SD3400A, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XA3SD3400ABlock RAMDSPParts
XA3SD3400ASpartan-353,712The original2,268 Kb2
XC7K70TKintex-765,6001.2× the logic cells4,860 Kb24016
XCSU60PSpartan UltraScale+65,6251.2× the logic cells3,456 Kb1444
XC7A75TArtix-775,5201.4× the logic cells3,780 Kb18026
XA7A75TArtix-775,5201.4× the logic cells3,780 Kb5
XC7S75Spartan-776,8001.4× the logic cells4,230 Kb14012
XA7S75Spartan-776,8001.4× the logic cells3,240 Kb1405

Substitutes listed by distributors

Parts distributors list as substitutes for the XA3SD3400A. This is what the trade buys instead — not a manufacturer equivalence, and some are other vendors' silicon entirely. Check any of them against your design.

  • T55F484I4Efinix, Inc.

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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