XCZU67DR-1FFVE1156I
AMD Xilinx Zynq UltraScale+ RFSoC
489K logic cells 1,156-ball BGA Industrial
Available
The XCZU67DR-1FFVE1156I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU67DR device, with 489,300 logic cells, 23,328 Kb of block RAM and 1,872 DSP slices. It comes in the FFVE1156 package (1156-FCBGA, 35 × 35 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It has 157 user I/O in this package.
- Logic cells
- 489,300
- Block RAM
- 23,328 Kb
- DSP slices
- 1,872
- Balls
- 1,156
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU67DR-1FFVE1156I
- Base device
- XCZU67DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVE1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -1
- Temperature grade
- Industrial
Device specifications
- Logic cells
- 489,300
- DSP slices
- 1,872
- Block RAM
- 23,328 Kb
- User I/O (FFVE1156)
- 157
- LUTs
- 223,680
- Flip-flops
- 447,360
- Block RAM blocks (36 Kb)
- 648
- Distributed RAM
- 6.9 Mb
- UltraRAM
- 45 Mb
- Clock management tiles
- 5
- GTY transceivers
- 8
Specifications
- Package outline
- 1156-FCBGA, 35 × 35 mm
- Package / case
- 1156-BBGA, FCBGA
- FPGA fabric
- Zynq UltraScale+ RFSoC
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 1.2 GHz
- Processor core
- Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
- Operating temperature
- -40 °C to 100 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU67DR | Base Device | Zynq UltraScale+ RFSoC device XCZU67DR |
| 1 | Speed Grade | Speed grade 1 |
| FFVE1156 | Package | 1156-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Documentation
- XCZU67DR-1FFVE1156I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU67DR-2FFVE1156I | Same device, different speed grade | FFVE1156 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- What package is the XCZU67DR-1FFVE1156I?
- The XCZU67DR-1FFVE1156I comes in the FFVE1156 BGA package (1156-FCBGA, 35 × 35 mm).
- Which versions of the XCZU67DR come in industrial temperature?
- The XCZU67DR-1FFVE1156I is itself an industrial-temperature part (-40 °C to 100 °C, junction). One other XCZU67DR part is industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU67DR-2FFVE1156I
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