XCZU67DR-1FFVE1156C
AMD XilinxZynq UltraScale+ RFSoCRFSoC
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU67DR-1FFVE1156C
- Base device
- XCZU67DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVE1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -1
- Temperature grade
- Commercial
Device specifications
- User I/O (FFVE1156)
- 157
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU67DR | Base Device | Zynq UltraScale+ RFSoC device XCZU67DR |
| 1 | Speed Grade | Speed grade 1 |
| FFVE1156 | Package | 1156-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU67DR-1FFVE1156I | Same device, industrial temperature | FFVE1156 | -1 | Industrial |
| XCZU67DR-1FFVE1156E | Same device, extended temperature | FFVE1156 | -1 | Extended |
| XCZU67DR-2FFVE1156C | Same device, different speed grade | FFVE1156 | -2 | Commercial |
| XCZU67DR-2FFVE1156I | Same device, different speed and temperature grade | FFVE1156 | -2 | Industrial |
| XCZU67DR-2FFVE1156E | Same device, different speed and temperature grade | FFVE1156 | -2 | Extended |
| XCZU67DR-3FFVE1156C | Same device, different speed grade | FFVE1156 | -3 | Commercial |
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