FPGA Market

XCZU55DR-L1FSVE1156I

AMD Xilinx Zynq UltraScale+ RFSoC

1,156-ball Industrial

AvailableLifecycle: Active

The XCZU55DR-L1FSVE1156I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU55DR device. It is rated industrial temperature (-40 °C to 100 °C, junction). It is in active production.

Pins
1,156
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU55DR-L1FSVE1156I
Base device
XCZU55DR
Family
Zynq UltraScale+ RFSoC
Pin / ball count
1,156
Temperature grade
Industrial
Product status
Active
HTS code
8542.31.0070
RoHS
Compliant

Device specifications

Specifications

Package outline
1156-FCBGA, 35 × 35 mm
Package / case
1156-BBGA, FCBGA
FPGA fabric
Zynq UltraScale+ RFSoC
Architecture
MPU, FPGA
Speed
500 MHz, 1.2 GHz
Processor core
Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
Interfaces
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DDR, DMA, PCIe, WDT
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 4 (72 hours)
Series
Zynq UltraScale+ RFSoC DR

Part number breakdown

SegmentFieldMeaning
XCZU55DRBase DeviceZynq UltraScale+ RFSoC device XCZU55DR
1156Pin/Ball Count1156 pins
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU55DR-2FSVE1156ISame device, industrial temperatureIndustrial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XCZU55DR-L1FSVE1156I still in production?
Yes. The XCZU55DR-L1FSVE1156I is in active production.
Which versions of the XCZU55DR come in industrial temperature?
The XCZU55DR-L1FSVE1156I is itself an industrial-temperature part (-40 °C to 100 °C, junction). One other XCZU55DR part is industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU55DR-2FSVE1156I

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