XCZU47DR-1FFVE1156I
AMD Xilinx Zynq UltraScale+ RFSoC
930K logic cells 1,156-ball BGA Industrial
AvailableLifecycle: Active
The XCZU47DR-1FFVE1156I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU47DR device, with 930,300 logic cells, 38,880 Kb of block RAM and 4,272 DSP slices. It comes in the FFVE1156 package (1156-FCBGA, 35 × 35 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It has 154 user I/O in this package. It is in active production.
- Logic cells
- 930,300
- Block RAM
- 38,880 Kb
- DSP slices
- 4,272
- Balls
- 1,156
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU47DR-1FFVE1156I
- Base device
- XCZU47DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVE1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -1
- Temperature grade
- Industrial
- Product status
- Active
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- Logic cells
- 930,300
- DSP slices
- 4,272
- Block RAM
- 38,880 Kb
- User I/O (FFVE1156)
- 154
- LUTs
- 425,280
- Flip-flops
- 850,560
- Block RAM blocks (36 Kb)
- 1,080
- Distributed RAM
- 13 Mb
- UltraRAM
- 22.5 Mb
- Clock management tiles
- 8
- GTY transceivers
- 16
Specifications
- Package outline
- 1156-FCBGA, 35 × 35 mm
- Package / case
- 1156-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 930K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 1.2 GHz
- Processor core
- Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ RFSoC
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU47DR | Base Device | Zynq UltraScale+ RFSoC device XCZU47DR |
| 1 | Speed Grade | Speed grade 1 |
| FFVE1156 | Package | 1156-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Documentation
- XCZU47DR-L2FFVE1156I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU47DR-1FFVE1156E | Same device, extended temperature | FFVE1156 | -1 | Extended |
| XCZU47DR-2FFVE1156I | Same device, different speed grade | FFVE1156 | -2 | Industrial |
| XCZU47DR-2FFVE1156E | Same device, different speed and temperature grade | FFVE1156 | -2 | Extended |
| XCZU47DR-1FFVG1517I | Same device, different package | FFVG1517 | -1 | Industrial |
| XCZU47DR-1FFVG1517E | Same device, different package | FFVG1517 | -1 | Extended |
| XCZU47DR-2FFVG1517I | Same device, different package | FFVG1517 | -2 | Industrial |
| XCZU47DR-2FFVG1517E | Same device, different package | FFVG1517 | -2 | Extended |
| XCZU47DR-L2FFVE1156I | Same device, different package | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU47DR-1FFVE1156I still in production?
- Yes. The XCZU47DR-1FFVE1156I is in active production.
- What package is the XCZU47DR-1FFVE1156I?
- The XCZU47DR-1FFVE1156I comes in the FFVE1156 BGA package (1156-FCBGA, 35 × 35 mm).
- Which versions of the XCZU47DR come in industrial temperature?
- The XCZU47DR-1FFVE1156I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 4 other XCZU47DR parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU47DR-2FFVE1156IXCZU47DR-1FFVG1517IXCZU47DR-2FFVG1517IXCZU47DR-L2FFVE1156I
Guides and comparisons
Need XCZU47DR-1FFVE1156I?
Send the quantity and we'll check current market availability, pricing and lead time.
Check Stock & Pricing