FPGA Market

XCZU43DR-2FFVE1156E

AMD XilinxZynq UltraScale+ RFSoCRFSoC

Part details

Manufacturer
AMD Xilinx
Part number
XCZU43DR-2FFVE1156E
Base device
XCZU43DR
Family
Zynq UltraScale+ RFSoC
Package
FFVE1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-2
Temperature grade
Extended

Device specifications

User I/O (FFVE1156)
154

Part number breakdown

SegmentFieldMeaning
XCZU43DRBase DeviceZynq UltraScale+ RFSoC device XCZU43DR
2Speed GradeSpeed grade 2
FFVE1156Package1156-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU43DR-1FFVE1156CSame device, different speed and temperature gradeFFVE1156-1Commercial
XCZU43DR-1FFVE1156ISame device, different speed and temperature gradeFFVE1156-1Industrial
XCZU43DR-1FFVE1156ESame device, different speed gradeFFVE1156-1Extended
XCZU43DR-2FFVE1156CSame device, commercial temperatureFFVE1156-2Commercial
XCZU43DR-2FFVE1156ISame device, industrial temperatureFFVE1156-2Industrial
XCZU43DR-3FFVE1156CSame device, different speed and temperature gradeFFVE1156-3Commercial
XCZU43DR-1FFVG1517CSame device, different packageFFVG1517-1Commercial
XCZU43DR-1FFVG1517ISame device, different packageFFVG1517-1Industrial
XCZU43DR-1FFVG1517ESame device, different packageFFVG1517-1Extended
XCZU43DR-2FFVG1517CSame device, different packageFFVG1517-2Commercial
XCZU43DR-2FFVG1517ISame device, different packageFFVG1517-2Industrial
XCZU43DR-2FFVG1517ESame device, different packageFFVG1517-2Extended
XCZU43DR-3FFVG1517CSame device, different packageFFVG1517-3Commercial

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