XCZU1EG-1SFVA625I
AMD Xilinx Zynq UltraScale+ soc fpga
82K system logic cells 625-ball BGA Industrial
AvailableLifecycle: Active
The XCZU1EG-1SFVA625I is an AMD Xilinx Zynq UltraScale+ soc fpga based on the XCZU1EG device, with 81,900 system logic cells, 3,888 Kb of block RAM and 216 DSP slices. It comes in the SFVA625 package (625-FCBGA, 21 × 21 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 183 user I/O in this package. It is in active production.
- System Logic Cells
- 81,900
- Block RAM
- 3,888 Kb
- DSP slices
- 216
- Balls
- 625
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU1EG-1SFVA625I
- Base device
- XCZU1EG
- Family
- Zynq UltraScale+
- Package
- SFVA625
- Package type
- BGA
- Pin / ball count
- 625
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 81,900
- DSP slices
- 216
- Block RAM
- 3,888 Kb
- User I/O (SFVA625)
- 183
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 37,440
- Flip-flops
- 74,880
- Block RAM blocks (36 Kb)
- 108
- Distributed RAM
- 1 Mb
- Clock management tiles
- 3
Specifications
- Package outline
- 625-FCBGA, 21 × 21 mm
- Package / case
- 625-BFBGA, FCBGA
- Architecture
- MPU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU1EG | Base Device | Zynq UltraScale+ MPSoC device XCZU1EG |
| 1 | Speed Grade | Speed grade 1 |
| SFVA625 | Package | 625-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Documentation
- XCZU1EG-1SBVA484I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU1EG-1SFVA625E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | SFVA625 | -1 | Extended |
| XCZU1EG-2SFVA625I | Likely alternative · 89/100Faster -2 speed grade, same device and package | SFVA625 | -2 | Industrial |
| XCZU1EG-2SFVA625E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | SFVA625 | -2 | Extended |
| XCZU2EG-1SFVA625I | Engineering review required · 59/100Same SFVA625 balls, but 24 I/O sit in renumbered banks: constraints change. Different device: the design must be rebuilt | SFVA625 | -1 | Industrial |
| XCZU3EG-1SFVA625I | Engineering review required · 59/100Same SFVA625 balls, but 24 I/O sit in renumbered banks: constraints change. Different device: the design must be rebuilt | SFVA625 | -1 | Industrial |
| XCZU1CG-1SFVA625I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. All 625 balls identical in the SFVA625 package | SFVA625 | -1 | Industrial |
| XCZU2CG-1SFVA625I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Same SFVA625 balls, but 24 I/O sit in renumbered banks: constraints change | SFVA625 | -1 | Industrial |
| XCZU3CG-1SFVA625I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Same SFVA625 balls, but 24 I/O sit in renumbered banks: constraints change | SFVA625 | -1 | Industrial |
| XCZU1EG-1SBVA484I | Same device, different package | SBVA484 | -1 | Industrial |
| XCZU1EG-1SBVA484E | Same device, different package | SBVA484 | -1 | Extended |
| XCZU1EG-2SBVA484I | Same device, different package | SBVA484 | -2 | Industrial |
| XCZU1EG-2SBVA484E | Same device, different package | SBVA484 | -2 | Extended |
| XCZU1EG-1SFVC784I | Same device, different package | SFVC784 | -1 | Industrial |
| XCZU1EG-1SFVC784E | Same device, different package | SFVC784 | -1 | Extended |
| XCZU1EG-2SFVC784I | Same device, different package | SFVC784 | -2 | Industrial |
| XCZU1EG-2SFVC784E | Same device, different package | SFVC784 | -2 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU1EG-1SFVA625I still in production?
- Yes. The XCZU1EG-1SFVA625I is in active production.
- What package is the XCZU1EG-1SFVA625I?
- The XCZU1EG-1SFVA625I comes in the SFVA625 BGA package (625-FCBGA, 21 × 21 mm).
- Which versions of the XCZU1EG come in industrial temperature?
- The XCZU1EG-1SFVA625I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XCZU1EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU1EG-2SFVA625IXCZU1EG-1SBVA484IXCZU1EG-2SBVA484IXCZU1EG-1SFVC784IXCZU1EG-2SFVC784I
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