XCXQZU19EGFF-1RB1517C
AMD XilinxZynq UltraScale+SoC FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCXQZU19EGFF-1RB1517C
- Base device
- XCXQZU19EGFF
- Family
- Zynq UltraScale+
- Package
- RB1517
- Package type
- BGA
- Pin / ball count
- 1,517
- Speed grade
- -1
- Temperature grade
- Commercial
Device specifications
- User I/O (RB1517)
- 655
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCXQZU19EGFF | Base Device | Device XCXQZU19EGFF |
| 1 | Speed Grade | Speed grade 1 |
| RB1517 | Package | 1517-pin BGA (ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCXQZU19EGFF-1RB1517I | Same device, industrial temperature | RB1517 | -1 | Industrial |
| XCXQZU19EGFF-1RB1517E | Same device, extended temperature | RB1517 | -1 | Extended |
| XCXQZU19EGFF-2RB1517C | Same device, different speed grade | RB1517 | -2 | Commercial |
| XCXQZU19EGFF-2RB1517I | Same device, different speed and temperature grade | RB1517 | -2 | Industrial |
| XCXQZU19EGFF-2RB1517E | Same device, different speed and temperature grade | RB1517 | -2 | Extended |
| XCXQZU19EGFF-3RB1517C | Same device, different speed grade | RB1517 | -3 | Commercial |
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