FPGA Market

XCV600-4FG676I

AMD Xilinx Virtex 2.5V FPGA

16K logic cells 676-ball Industrial

AvailableLifecycle: Obsolete

The XCV600-4FG676I is an AMD Xilinx Virtex 2.5V FPGA based on the XCV600 device, with 15,552 logic cells and 96 Kb of block RAM. It comes in the FG676 package (676-FBGA, 27 × 27 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
15,552
Block RAM
96 Kb
Pins
676
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCV600-4FG676I
Base device
XCV600
Family
Virtex 2.5V
Package
FG676
Pin / ball count
676
Speed grade
4
Temperature grade
Industrial
Product status
Obsolete
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
15,552
Block RAM
96 Kb

Specifications

Package outline
676-FBGA, 27 × 27 mm
Package / case
676-BGA
Mounting
Surface Mount
User I/O
444
LABs / CLBs
3,456
System gates
661,111
Supply voltage
2.375 V to 2.625 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Virtex
Last time buy
18 Oct 2011

Part number breakdown

SegmentFieldMeaning
XCV600Base DeviceDevice XCV600
4Speed GradeSpeed grade 4
FG676Package676-pin BGA (fine-pitch ball grid array)
ITemperature GradeIndustrial

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCV600-4BG432CSame device, different packageBG432-4Commercial
XCV600-4BG432ISame device, different packageBG432-4Industrial
XCV600-5BG432CSame device, different packageBG432-5Commercial
XCV600-5BG432ISame device, different packageBG432-5Industrial
XCV600-6BG432CSame device, different packageBG432-6Commercial
XCV600-4BG560CSame device, different packageBG560-4Commercial
XCV600-4BG560ISame device, different packageBG560-4Industrial
XCV600-5BG560CSame device, different packageBG560-5Commercial
XCV600-6BG560CSame device, different packageBG560-6Commercial
XCV600-4FG676CSame device, commercial temperatureFG676-4Commercial
XCV600-5FG676CSame device, different speed and temperature gradeFG676-5Commercial
XCV600-5FG676ISame device, different speed gradeFG676-5Industrial
XCV600-6FG676CSame device, different speed and temperature gradeFG676-6Commercial
XCV600-5FG680CSame device, different packageFG680-5Commercial
XCV600-5FG680ISame device, different packageFG680-5Industrial
XCV600-6FG680CSame device, different packageFG680-6Commercial
XCV600-4HQ240CSame device, different packageHQ240-4Commercial
XCV600-4HQ240ISame device, different packageHQ240-4Industrial
XCV600-5HQ240CSame device, different packageHQ240-5Commercial
XCV600-5HQ240ISame device, different packageHQ240-5Industrial
XCV600-6HQ240CSame device, different packageHQ240-6Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XCV600-4FG676I still in production?
No. The XCV600-4FG676I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
What package is the XCV600-4FG676I?
The XCV600-4FG676I comes in the FG676 package (676-FBGA, 27 × 27 mm).
Which versions of the XCV600 come in industrial temperature?
The XCV600-4FG676I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 7 other XCV600 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCV600-5FG676IXCV600-4BG432IXCV600-5BG432IXCV600-4BG560IXCV600-5FG680IXCV600-4HQ240IXCV600-5HQ240I

XCV600 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XCV600 replacement options

Guides and comparisons

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