FPGA Market

XCV400-6FG676C

AMD Xilinx Virtex 2.5V FPGA

11K logic cells 676-ball Commercial

AvailableLifecycle: Obsolete

The XCV400-6FG676C is an AMD Xilinx Virtex 2.5V FPGA based on the XCV400 device, with 10,800 logic cells and 80 Kb of block RAM. It comes in the FG676 package (676-FBGA, 27 × 27 mm), speed grade 6, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
10,800
Block RAM
80 Kb
Pins
676
Speed grade
6
Temperature
Commercial

Part details

Manufacturer
AMD Xilinx
Part number
XCV400-6FG676C
Base device
XCV400
Family
Virtex 2.5V
Package
FG676
Pin / ball count
676
Speed grade
6
Temperature grade
Commercial
Product status
Obsolete
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
10,800
Block RAM
80 Kb

Specifications

Package outline
676-FBGA, 27 × 27 mm
Package / case
676-BGA
Mounting
Surface Mount
User I/O
404
LABs / CLBs
2,400
System gates
468,252
Supply voltage
2.375 V to 2.625 V
Operating temperature
0 °C to 85 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Virtex
Last time buy
18 Oct 2011

Part number breakdown

SegmentFieldMeaning
XCV400Base DeviceDevice XCV400
6Speed GradeSpeed grade 6
FG676Package676-pin BGA (fine-pitch ball grid array)
CTemperature GradeCommercial

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCV400-4BG432CSame device, different packageBG432-4Commercial
XCV400-4BG432ISame device, different packageBG432-4Industrial
XCV400-5BG432CSame device, different packageBG432-5Commercial
XCV400-5BG432ISame device, different packageBG432-5Industrial
XCV400-6BG432CSame device, different packageBG432-6Commercial
XCV400-4BG560CSame device, different packageBG560-4Commercial
XCV400-4BG560ISame device, different packageBG560-4Industrial
XCV400-5BG560CSame device, different packageBG560-5Commercial
XCV400-5BG560ISame device, different packageBG560-5Industrial
XCV400-6BG560CSame device, different packageBG560-6Commercial
XCV400-4FG676CSame device, different speed gradeFG676-4Commercial
XCV400-4FG676ISame device, different speed and temperature gradeFG676-4Industrial
XCV400-5FG676ISame device, different speed and temperature gradeFG676-5Industrial
XCV400-4HQ240CSame device, different packageHQ240-4Commercial
XCV400-4HQ240ISame device, different packageHQ240-4Industrial
XCV400-5HQ240CSame device, different packageHQ240-5Commercial
XCV400-5HQ240ISame device, different packageHQ240-5Industrial
XCV400-6HQ240CSame device, different packageHQ240-6Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XCV400-6FG676C still in production?
No. The XCV400-6FG676C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
What package is the XCV400-6FG676C?
The XCV400-6FG676C comes in the FG676 package (676-FBGA, 27 × 27 mm).
Which versions of the XCV400 come in industrial temperature?
The XCV400-6FG676C is not an industrial-temperature part. 8 XCV400 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCV400-4FG676IXCV400-5FG676IXCV400-4BG432IXCV400-5BG432IXCV400-4BG560IXCV400-5BG560IXCV400-4HQ240IXCV400-5HQ240I

XCV400 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XCV400 replacement options

Guides and comparisons

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