XCV1600E-6BG560C
AMD Xilinx Virtex-E 1.8V FPGA
35K logic cells 560-ball Commercial
The XCV1600E-6BG560C is an AMD Xilinx Virtex-E 1.8V FPGA based on the XCV1600E device, with 34,992 logic cells and 576 Kb of block RAM. It comes in the BG560 package (560-MBGA, 42.5 × 42.5 mm), speed grade 6, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 34,992
- Block RAM
- 576 Kb
- Pins
- 560
- Speed grade
- 6
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCV1600E-6BG560C
- Base device
- XCV1600E
- Family
- Virtex-E 1.8V
- Package
- BG560
- Pin / ball count
- 560
- Speed grade
- 6
- Temperature grade
- Commercial
- Product status
- Obsolete
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Not compliant
Device specifications
- Logic cells
- 34,992
- Block RAM
- 576 Kb
Specifications
- Package outline
- 560-MBGA, 42.5 × 42.5 mm
- Package / case
- 560-LBGA Exposed Pad, Metal
- Mounting
- Surface Mount
- User I/O
- 404
- LABs / CLBs
- 7,776
- System gates
- 2,188,742
- Supply voltage
- 1.71 V to 1.89 V
- Operating temperature
- 0 °C to 85 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Virtex-E
- Last time buy
- 20 May 2013
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCV1600E | Base Device | Device XCV1600E |
| 6 | Speed Grade | Speed grade 6 |
| BG560 | Package | 560-pin BGA (ball grid array) |
| C | Temperature Grade | Commercial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCV1600E-7BG560I | Same device, different speed and temperature grade | BG560 | -7 | Industrial |
| XCV1600E-8BG560C | Same device, different speed grade | BG560 | -8 | Commercial |
| XCV1600E-7FG1156C | Same device, different package | FG1156 | -7 | Commercial |
| XCV1600E-6FG680C | Same device, different package | FG680 | -6 | Commercial |
| XCV1600E-7FG860C | Same device, different package | FG860 | -7 | Commercial |
| XCV1600E-8FG860C | Same device, different package | FG860 | -8 | Commercial |
| XCV1600E-6FG900C | Same device, different package | FG900 | -6 | Commercial |
| XCV1600E-6FG900I | Same device, different package | FG900 | -6 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCV1600E-6BG560C still in production?
- No. The XCV1600E-6BG560C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- What package is the XCV1600E-6BG560C?
- The XCV1600E-6BG560C comes in the BG560 package (560-MBGA, 42.5 × 42.5 mm).
- Which versions of the XCV1600E come in industrial temperature?
- The XCV1600E-6BG560C is not an industrial-temperature part. 2 XCV1600E parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCV1600E-7BG560IXCV1600E-6FG900I
XCV1600E discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XCV1600E replacement optionsGuides and comparisons
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