XCSU25P-2SBVB625C
AMD XilinxSpartan UltraScale+FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCSU25P-2SBVB625C
- Base device
- XCSU25P
- Family
- Spartan UltraScale+
- Package
- SBVB625
- Package type
- BGA
- Pin / ball count
- 625
- Speed grade
- -2
- Temperature grade
- Commercial
Device specifications
- User I/O (SBVB625)
- 305
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCSU25P | Base Device | Spartan UltraScale+ device XCSU25P |
| 2 | Speed Grade | Speed grade 2 |
| SBVB625 | Package | 625-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCSU25P-1SBVB625C | Same device, different speed grade | SBVB625 | -1 | Commercial |
| XCSU25P-1SBVB625I | Same device, different speed and temperature grade | SBVB625 | -1 | Industrial |
| XCSU25P-1SBVB625E | Same device, different speed and temperature grade | SBVB625 | -1 | Extended |
| XCSU25P-2SBVB625I | Same device, industrial temperature | SBVB625 | -2 | Industrial |
| XCSU25P-2SBVB625E | Same device, extended temperature | SBVB625 | -2 | Extended |
| XCSU25P-3SBVB625C | Same device, different speed grade | SBVB625 | -3 | Commercial |
| XCSU25P-1CMVA361I | Same device, different package | Industrial | ||
| XCSU25P-1CMVA361E | Same device, different package | Extended |
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