XCSU25P-1SBVB625I
AMD Xilinx Spartan UltraScale+ FPGA
22K logic cells 625-ball BGA Industrial
AvailableLifecycle: Active
The XCSU25P-1SBVB625I is an AMD Xilinx Spartan UltraScale+ FPGA based on the XCSU25P device, with 21,875 logic cells, 1,728 Kb of block RAM and 36 DSP slices. It comes in the SBVB625 package (625-FCBGA, 21 × 21 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It has 305 user I/O in this package. It is in active production.
- Logic cells
- 21,875
- Block RAM
- 1,728 Kb
- DSP slices
- 36
- Balls
- 625
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCSU25P-1SBVB625I
- Base device
- XCSU25P
- Family
- Spartan UltraScale+
- Package
- SBVB625
- Package type
- BGA
- Pin / ball count
- 625
- Speed grade
- -1
- Temperature grade
- Industrial
- Product status
- Active
- ECCN
- 5A002.A.4
- HTS code
- 8542310060
- RoHS
- Compliant
Device specifications
- Logic cells
- 21,875
- DSP slices
- 36
- Block RAM
- 1,728 Kb
- User I/O (SBVB625)
- 305
- LUTs
- 10,000
- Flip-flops
- 20,000
- Block RAM blocks (36 Kb)
- 48
- Distributed RAM
- 0.1 Mb
Specifications
- Package outline
- 625-FCBGA, 21 × 21 mm
- Package / case
- 625-BGA, FCBGA
- Mounting
- Surface Mount
- Supply voltage
- 0.825 V to 0.876 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Spartan UltraScale+
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCSU25P | Base Device | Spartan UltraScale+ device XCSU25P |
| 1 | Speed Grade | Speed grade 1 |
| SBVB625 | Package | 625-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Documentation
- XCSU25P-1SBVB625I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCSU25P-1SBVB625E | Same device, extended temperature | SBVB625 | -1 | Extended |
| XCSU25P-2SBVB625I | Same device, different speed grade | SBVB625 | -2 | Industrial |
| XCSU25P-2SBVB625E | Same device, different speed and temperature grade | SBVB625 | -2 | Extended |
| XCSU25P-1CMVA361I | Same device, different package | Industrial | ||
| XCSU25P-1CMVA361E | Same device, different package | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCSU25P-1SBVB625I still in production?
- Yes. The XCSU25P-1SBVB625I is in active production.
- What package is the XCSU25P-1SBVB625I?
- The XCSU25P-1SBVB625I comes in the SBVB625 BGA package (625-FCBGA, 21 × 21 mm).
- Which versions of the XCSU25P come in industrial temperature?
- The XCSU25P-1SBVB625I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 2 other XCSU25P parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCSU25P-2SBVB625IXCSU25P-1CMVA361I
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