XCS30-3BG256C
AMD Xilinx Spartan and Spartan-XL Families FPGA
1K logic cells 256-ball Commercial
The XCS30-3BG256C is an AMD Xilinx Spartan and Spartan-XL FPGA based on the XCS30 device, with 1,368 logic cells and 18 Kb of block RAM. It comes in the BG256 package (256-PBGA, 27 × 27 mm), speed grade 3, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 1,368
- Block RAM
- 18 Kb
- Pins
- 256
- Speed grade
- 3
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCS30-3BG256C
- Base device
- XCS30
- Family
- Spartan and Spartan-XL Families
- Package
- BG256
- Pin / ball count
- 256
- Speed grade
- 3
- Temperature grade
- Commercial
- Product status
- Obsolete
- ECCN
- EAR99
- HTS code
- 8542.31.0060
- RoHS
- Not compliant
Device specifications
- Logic cells
- 1,368
- Block RAM
- 18 Kb
Specifications
- Package outline
- 256-PBGA, 27 × 27 mm
- Package / case
- 256-BBGA
- Mounting
- Surface Mount
- User I/O
- 192
- LABs / CLBs
- 576
- System gates
- 30,000
- Supply voltage
- 4.75 V to 5.25 V
- Operating temperature
- 0 °C to 85 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Spartan
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCS30 | Base Device | Device XCS30 |
| 3 | Speed Grade | Speed grade 3 |
| BG256 | Package | 256-pin BGA (ball grid array) |
| C | Temperature Grade | Commercial |
Documentation
- XCS30-4VQ100C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCS30-3PQ208C | Same device, different package | PQ208 | -3 | Commercial |
| XCS30-3PQ208I | Same device, different package | PQ208 | -3 | Industrial |
| XCS30-4PQ208C | Same device, different package | PQ208 | -4 | Commercial |
| XCS30-3PQ240C | Same device, different package | PQ240 | -3 | Commercial |
| XCS30-4PQ240C | Same device, different package | PQ240 | -4 | Commercial |
| XCS30-3PQG208C | Same device, different package | PQG208 | -3 | Commercial |
| XCS30-3TQ144C | Same device, different package | TQ144 | -3 | Commercial |
| XCS30-3TQ144I | Same device, different package | TQ144 | -3 | Industrial |
| XCS30-4TQ144C | Same device, different package | TQ144 | -4 | Commercial |
| XCS30-3VQ100C | Same device, different package | VQ100 | -3 | Commercial |
| XCS30-4VQ100C | Same device, different package | VQ100 | -4 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCS30-3BG256C still in production?
- No. The XCS30-3BG256C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- What package is the XCS30-3BG256C?
- The XCS30-3BG256C comes in the BG256 package (256-PBGA, 27 × 27 mm).
- Which versions of the XCS30 come in industrial temperature?
- The XCS30-3BG256C is not an industrial-temperature part. 2 XCS30 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCS30-3PQ208IXCS30-3TQ144I
XCS30 discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XCS30 replacement optionsGuides and comparisons
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