FPGA Market

XCKU19P-3FFVB2104E

AMD Xilinx Kintex UltraScale+ FPGA

1.84M logic cells 2,104-ball BGA Extended

AvailableLifecycle: Active

The XCKU19P-3FFVB2104E is an AMD Xilinx Kintex UltraScale+ FPGA based on the XCKU19P device, with 1,842,750 logic cells, 62,208 Kb of block RAM and 1,080 DSP slices. It comes in the FFVB2104 package (2104-FCBGA, 47.5 × 47.5 mm), speed grade 3, extended temperature (0 °C to 100 °C, junction). It runs from a 0.9 V core supply (VCCINT) and has 549 user I/O in this package. It is in active production.

Logic cells
1,842,750
Block RAM
62,208 Kb
DSP slices
1,080
Balls
2,104
Speed grade
3
Temperature
Extended

Part details

Manufacturer
AMD Xilinx
Part number
XCKU19P-3FFVB2104E
Base device
XCKU19P
Family
Kintex UltraScale+
Package
FFVB2104
Package type
BGA
Pin / ball count
2,104
Speed grade
3
Temperature grade
Extended
Core supply (VCCINT)
0.9 V
Product status
Active
ECCN
3A001A7B
HTS code
8542.31.0060
RoHS
Compliant

Device specifications

Logic cells
1,842,750
DSP slices
1,080
Block RAM
62,208 Kb
User I/O (FFVB2104)
549
LUTs
842,400
Flip-flops
1,684,800
Block RAM blocks (36 Kb)
1,728
Distributed RAM
11.6 Mb
UltraRAM
81 Mb

Specifications

Package outline
2104-FCBGA, 47.5 × 47.5 mm
Package / case
2104-BBGA, FCBGA
Mounting
Surface Mount
LABs / CLBs
105,300
Supply voltage
0.873 V to 0.927 V
Operating temperature
0 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 4 (72 hours)
Series
Virtex UltraScale+

Part number breakdown

SegmentFieldMeaning
XCKU19PBase DeviceKintex UltraScale+ device XCKU19P
3Speed GradeSpeed grade 3
FFVB2104Package2104-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCKU19P-1FFVB2104ISignificant migration work · 45/100Needs 0.85 V VCCINT instead of 0.9 V. Slower -1 speed grade: timing must be re-closedFFVB2104-1Industrial
XCKU19P-1FFVB2104ESignificant migration work · 45/100Needs 0.85 V VCCINT instead of 0.9 V. Slower -1 speed grade: timing must be re-closedFFVB2104-1Extended
XCKU19P-2FFVB2104ISignificant migration work · 45/100Needs 0.85 V VCCINT instead of 0.9 V. Slower -2 speed grade: timing must be re-closedFFVB2104-2Industrial
XCKU19P-2FFVB2104ESignificant migration work · 45/100Needs 0.85 V VCCINT instead of 0.9 V. Slower -2 speed grade: timing must be re-closedFFVB2104-2Extended
XCKU19P-1FFVJ1760ISame device, different packageFFVJ1760-1Industrial
XCKU19P-1FFVJ1760ESame device, different packageFFVJ1760-1Extended
XCKU19P-2FFVJ1760ISame device, different packageFFVJ1760-2Industrial
XCKU19P-2FFVJ1760ESame device, different packageFFVJ1760-2Extended

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XCKU19P-3FFVB2104E still in production?
Yes. The XCKU19P-3FFVB2104E is in active production.
What package is the XCKU19P-3FFVB2104E?
The XCKU19P-3FFVB2104E comes in the FFVB2104 BGA package (2104-FCBGA, 47.5 × 47.5 mm).
Which versions of the XCKU19P come in industrial temperature?
The XCKU19P-3FFVB2104E is not an industrial-temperature part. 4 XCKU19P parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCKU19P-1FFVB2104IXCKU19P-2FFVB2104IXCKU19P-1FFVJ1760IXCKU19P-2FFVJ1760I

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