XCKU19P-3FFVB2104C
AMD XilinxKintex UltraScale+FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCKU19P-3FFVB2104C
- Base device
- XCKU19P
- Family
- Kintex UltraScale+
- Package
- FFVB2104
- Package type
- BGA
- Pin / ball count
- 2,104
- Speed grade
- -3
- Temperature grade
- Commercial
Device specifications
- User I/O (FFVB2104)
- 549
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCKU19P | Base Device | Kintex UltraScale+ device XCKU19P |
| 3 | Speed Grade | Speed grade 3 |
| FFVB2104 | Package | 2104-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCKU19P-1FFVB2104C | Same device, different speed grade | FFVB2104 | -1 | Commercial |
| XCKU19P-1FFVB2104I | Same device, different speed and temperature grade | FFVB2104 | -1 | Industrial |
| XCKU19P-1FFVB2104E | Same device, different speed and temperature grade | FFVB2104 | -1 | Extended |
| XCKU19P-2FFVB2104C | Same device, different speed grade | FFVB2104 | -2 | Commercial |
| XCKU19P-2FFVB2104I | Same device, different speed and temperature grade | FFVB2104 | -2 | Industrial |
| XCKU19P-2FFVB2104E | Same device, different speed and temperature grade | FFVB2104 | -2 | Extended |
| XCKU19P-1FFVJ1760C | Same device, different package | FFVJ1760 | -1 | Commercial |
| XCKU19P-1FFVJ1760I | Same device, different package | FFVJ1760 | -1 | Industrial |
| XCKU19P-1FFVJ1760E | Same device, different package | FFVJ1760 | -1 | Extended |
| XCKU19P-2FFVJ1760C | Same device, different package | FFVJ1760 | -2 | Commercial |
| XCKU19P-2FFVJ1760I | Same device, different package | FFVJ1760 | -2 | Industrial |
| XCKU19P-2FFVJ1760E | Same device, different package | FFVJ1760 | -2 | Extended |
| XCKU19P-3FFVJ1760C | Same device, different package | FFVJ1760 | -3 | Commercial |
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