FPGA Market

XCKU19P-1FFVJ1760C

AMD XilinxKintex UltraScale+FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCKU19P-1FFVJ1760C
Base device
XCKU19P
Family
Kintex UltraScale+
Package
FFVJ1760
Package type
BGA
Pin / ball count
1,760
Speed grade
-1
Temperature grade
Commercial

Device specifications

User I/O (FFVJ1760)
549

Part number breakdown

SegmentFieldMeaning
XCKU19PBase DeviceKintex UltraScale+ device XCKU19P
1Speed GradeSpeed grade 1
FFVJ1760Package1760-pin BGA (flip-chip ball grid array)
CTemperature GradeCommercial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCKU19P-1FFVB2104CSame device, different packageFFVB2104-1Commercial
XCKU19P-1FFVB2104ISame device, different packageFFVB2104-1Industrial
XCKU19P-1FFVB2104ESame device, different packageFFVB2104-1Extended
XCKU19P-2FFVB2104CSame device, different packageFFVB2104-2Commercial
XCKU19P-2FFVB2104ISame device, different packageFFVB2104-2Industrial
XCKU19P-2FFVB2104ESame device, different packageFFVB2104-2Extended
XCKU19P-3FFVB2104CSame device, different packageFFVB2104-3Commercial
XCKU19P-1FFVJ1760ISame device, industrial temperatureFFVJ1760-1Industrial
XCKU19P-1FFVJ1760ESame device, extended temperatureFFVJ1760-1Extended
XCKU19P-2FFVJ1760CSame device, different speed gradeFFVJ1760-2Commercial
XCKU19P-2FFVJ1760ISame device, different speed and temperature gradeFFVJ1760-2Industrial
XCKU19P-2FFVJ1760ESame device, different speed and temperature gradeFFVJ1760-2Extended
XCKU19P-3FFVJ1760CSame device, different speed gradeFFVJ1760-3Commercial

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