XC7VX550T-2FFG1927I
AMD Xilinx Virtex-7 FPGA
554K logic cells 1,927-ball BGA Industrial
AvailableLifecycle: Active
The XC7VX550T-2FFG1927I is an AMD Xilinx Virtex-7 FPGA based on the XC7VX550T device, with 554,240 logic cells, 42,480 Kb of block RAM and 2,880 DSP slices. It comes in the FFG1927 package (1927-FCBGA, 45 × 45 mm), speed grade -2, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.0 V core supply (VCCINT) and has 600 user I/O in this package. It is in active production.
- Logic Cells
- 554,240
- Block RAM
- 42,480 Kb
- DSP slices
- 2,880
- Balls
- 1,927
- Speed grade
- -2
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC7VX550T-2FFG1927I
- Base device
- XC7VX550T
- Family
- Virtex-7
- Package
- FFG1927
- Package type
- BGA
- Pin / ball count
- 1,927
- Speed grade
- -2
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 1.0 V
- Product status
- Active
- ECCN
- 3A001A7A
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic Cells
- 554,240
- DSP slices
- 2,880
- Block RAM
- 42,480 Kb
- Transceivers
- 80
- Max transceiver rate
- 13.1 Gb/s
- User I/O (FFG1927)
- 600
Specifications
- Package outline
- 1927-FCBGA, 45 × 45 mm
- Package / case
- BBGA, FCBGA
- Mounting
- Surface Mount
- LABs / CLBs
- 43,300
- Supply voltage
- 0.97 V to 1.03 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Virtex-7 XT
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC7VX550T | Base Device | Virtex-7 device XC7VX550T |
| 2 | Speed Grade | Speed grade 2 |
| FFG1927 | Package | 1927-pin BGA (flip-chip ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XC7VX550T-1FFG1158C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC7VX550T-2FFG1927C | Engineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFG1927 | -2 | Commercial |
| XC7VX690T-2FFG1927I | Engineering review required · 71/100All 1,924 balls identical in the FFG1927 package. Different device: the design must be rebuilt | FFG1927 | -2 | Industrial |
| XC7VX415T-2FFG1927I | Engineering review required · 55/100160 I/O balls used by this part are not connected on the alternative. Smaller device (412,160 vs 554,240 logic cells) | FFG1927 | -2 | Industrial |
| XC7VX550T-1FFG1927C | Engineering review required · 69/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Slower -1 speed grade: timing must be re-closed | FFG1927 | -1 | Commercial |
| XC7VX550T-1FFG1927I | Engineering review required · 69/100Slower -1 speed grade: timing must be re-closed | FFG1927 | -1 | Industrial |
| XC7VX550T-1FFG1158C | Same device, different package | FFG1158 | -1 | Commercial |
| XC7VX550T-2FFG1158C | Same device, different package | FFG1158 | -2 | Commercial |
| XC7VX550T-2FFG1158I | Same device, different package | FFG1158 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC7VX550T-2FFG1927I still in production?
- Yes. The XC7VX550T-2FFG1927I is in active production.
- What package is the XC7VX550T-2FFG1927I?
- The XC7VX550T-2FFG1927I comes in the FFG1927 BGA package (1927-FCBGA, 45 × 45 mm).
- Which versions of the XC7VX550T come in industrial temperature?
- The XC7VX550T-2FFG1927I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 2 other XC7VX550T parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC7VX550T-1FFG1927IXC7VX550T-2FFG1158I
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