FPGA Market

XC7VX550T-2FFG1927I

AMD Xilinx Virtex-7 FPGA

554K logic cells 1,927-ball BGA Industrial

AvailableLifecycle: Active

The XC7VX550T-2FFG1927I is an AMD Xilinx Virtex-7 FPGA based on the XC7VX550T device, with 554,240 logic cells, 42,480 Kb of block RAM and 2,880 DSP slices. It comes in the FFG1927 package (1927-FCBGA, 45 × 45 mm), speed grade -2, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.0 V core supply (VCCINT) and has 600 user I/O in this package. It is in active production.

Logic Cells
554,240
Block RAM
42,480 Kb
DSP slices
2,880
Balls
1,927
Speed grade
-2
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC7VX550T-2FFG1927I
Base device
XC7VX550T
Family
Virtex-7
Package
FFG1927
Package type
BGA
Pin / ball count
1,927
Speed grade
-2
Temperature grade
Industrial
Core supply (VCCINT)
1.0 V
Product status
Active
ECCN
3A001A7A
HTS code
8542.31.0060
RoHS
Compliant

Device specifications

Logic Cells
554,240
DSP slices
2,880
Block RAM
42,480 Kb
Transceivers
80
Max transceiver rate
13.1 Gb/s
User I/O (FFG1927)
600

Specifications

Package outline
1927-FCBGA, 45 × 45 mm
Package / case
BBGA, FCBGA
Mounting
Surface Mount
LABs / CLBs
43,300
Supply voltage
0.97 V to 1.03 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 4 (72 hours)
Series
Virtex-7 XT

Part number breakdown

SegmentFieldMeaning
XC7VX550TBase DeviceVirtex-7 device XC7VX550T
2Speed GradeSpeed grade 2
FFG1927Package1927-pin BGA (flip-chip ball grid array, Pb-free)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC7VX550T-2FFG1927CEngineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed gradeFFG1927-2Commercial
XC7VX690T-2FFG1927IEngineering review required · 71/100All 1,924 balls identical in the FFG1927 package. Different device: the design must be rebuiltFFG1927-2Industrial
XC7VX415T-2FFG1927IEngineering review required · 55/100160 I/O balls used by this part are not connected on the alternative. Smaller device (412,160 vs 554,240 logic cells)FFG1927-2Industrial
XC7VX550T-1FFG1927CEngineering review required · 69/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Slower -1 speed grade: timing must be re-closedFFG1927-1Commercial
XC7VX550T-1FFG1927IEngineering review required · 69/100Slower -1 speed grade: timing must be re-closedFFG1927-1Industrial
XC7VX550T-1FFG1158CSame device, different packageFFG1158-1Commercial
XC7VX550T-2FFG1158CSame device, different packageFFG1158-2Commercial
XC7VX550T-2FFG1158ISame device, different packageFFG1158-2Industrial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC7VX550T-2FFG1927I still in production?
Yes. The XC7VX550T-2FFG1927I is in active production.
What package is the XC7VX550T-2FFG1927I?
The XC7VX550T-2FFG1927I comes in the FFG1927 BGA package (1927-FCBGA, 45 × 45 mm).
Which versions of the XC7VX550T come in industrial temperature?
The XC7VX550T-2FFG1927I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 2 other XC7VX550T parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC7VX550T-1FFG1927IXC7VX550T-2FFG1158I

Guides and comparisons

Need XC7VX550T-2FFG1927I?

Send the quantity and we'll check current market availability, pricing and lead time.

Check Stock & Pricing