FPGA Market

XC7S75-2FGGA676C

AMD XilinxSpartan-7FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XC7S75-2FGGA676C
Base device
XC7S75
Family
Spartan-7
Package
FGGA676
Package type
BGA
Pin / ball count
676
Speed grade
-2
Temperature grade
Commercial

Device specifications

Logic Cells
76,800
DSP slices
140
User I/O (FGGA676)
400

Part number breakdown

SegmentFieldMeaning
XC7S75Base DeviceSpartan-7 device XC7S75
2Speed GradeSpeed grade 2
FGGA676Package676-pin BGA (fine-pitch ball grid array, Pb-free)
CTemperature GradeCommercial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XC7S75-1FGGA484CSame device, different packageFGGA484-1Commercial
XC7S75-1FGGA484ISame device, different packageFGGA484-1Industrial
XC7S75-1LFGGA484CSame device, different packageFGGA484-1LCommercial
XC7S75-1LFGGA484ISame device, different packageFGGA484-1LIndustrial
XC7S75-2FGGA484CSame device, different packageFGGA484-2Commercial
XC7S75-2FGGA484ISame device, different packageFGGA484-2Industrial
XC7S75-1FGGA484QSame device, different packageFGGA4841Automotive
XC7S75-1FGGA676CSame device, different speed gradeFGGA676-1Commercial
XC7S75-1FGGA676ISame device, different speed and temperature gradeFGGA676-1Industrial
XC7S75-1LFGGA676CSame device, different speed gradeFGGA676-1LCommercial
XC7S75-1LFGGA676ISame device, different speed and temperature gradeFGGA676-1LIndustrial
XC7S75-2FGGA676ISame device, industrial temperatureFGGA676-2Industrial
XC7S75-1FGGA676QSame device, different speed and temperature gradeFGGA6761Automotive
XC7S75-L1FGGA484ISame device, different packageIndustrial
XC7S75-L1FGGA676ISame device, different packageIndustrial

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