FPGA Market

XC7K70T-2FBG676I

AMD Xilinx Kintex-7 FPGA

66K logic cells 676-ball BGA Industrial

AvailableLifecycle: Active

The XC7K70T-2FBG676I is an AMD Xilinx Kintex-7 FPGA based on the XC7K70T device, with 65,600 logic cells, 4,860 Kb of block RAM and 240 DSP slices. It comes in the FBG676 package (676-FCBGA, 27 × 27 mm), speed grade -2, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.0 V core supply (VCCINT) and has 300 user I/O in this package. It is in active production.

Logic Cells
65,600
Block RAM
4,860 Kb
DSP slices
240
Balls
676
Speed grade
-2
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC7K70T-2FBG676I
Base device
XC7K70T
Family
Kintex-7
Package
FBG676
Package type
BGA
Pin / ball count
676
Speed grade
-2
Temperature grade
Industrial
Core supply (VCCINT)
1.0 V
Product status
Active
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Compliant

Device specifications

Logic Cells
65,600
DSP slices
240
Block RAM
4,860 Kb
Transceivers
8
User I/O (FBG676)
300

Specifications

Package outline
676-FCBGA, 27 × 27 mm
Package / case
676-BBGA, FCBGA
Mounting
Surface Mount
LABs / CLBs
5,125
Supply voltage
0.97 V to 1.03 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 4 (72 hours)
Series
Kintex-7

Part number breakdown

SegmentFieldMeaning
XC7K70TBase DeviceKintex-7 device XC7K70T
2Speed GradeSpeed grade 2
FBG676Package676-pin BGA (fine-pitch ball grid array, Pb-free)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC7K70T-2FBG676CEngineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed gradeFBG676-2Commercial
XC7K70T-3FBG676EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -3 speed grade, same device and packageFBG676-3Extended
XC7K160T-2FBG676IEngineering review required · 67/100Same FBG676 pinout, plus 100 balls unconnected on this part's board. Different device: the design must be rebuiltFBG676-2Industrial
XC7K325T-2FBG676IEngineering review required · 67/100Same FBG676 pinout, plus 100 balls unconnected on this part's board. Different device: the design must be rebuiltFBG676-2Industrial
XC7K410T-2FBG676IEngineering review required · 67/100Same FBG676 pinout, plus 100 balls unconnected on this part's board. Different device: the design must be rebuiltFBG676-2Industrial
XC7K70T-1FBG676CEngineering review required · 69/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Slower -1 speed grade: timing must be re-closedFBG676-1Commercial
XC7K70T-1FBG676IEngineering review required · 69/100Slower -1 speed grade: timing must be re-closedFBG676-1Industrial
XC7K70T-1FB484ISame device, different packageFB484-1Industrial
XC7K70T-2FB484ISame device, different packageFB484-2Industrial
XC7K70T-1FB676ISame device, different packageFB676-1Industrial
XC7K70T-1FBG484CSame device, different packageFBG484-1Commercial
XC7K70T-1FBG484ISame device, different packageFBG484-1Industrial
XC7K70T-2FBG484CSame device, different packageFBG484-2Commercial
XC7K70T-2FBG484ISame device, different packageFBG484-2Industrial
XC7K70T-3FBG484ESame device, different packageFBG484-3Extended

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC7K70T-2FBG676I still in production?
Yes. The XC7K70T-2FBG676I is in active production.
What package is the XC7K70T-2FBG676I?
The XC7K70T-2FBG676I comes in the FBG676 BGA package (676-FCBGA, 27 × 27 mm).
Which versions of the XC7K70T come in industrial temperature?
The XC7K70T-2FBG676I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 6 other XC7K70T parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC7K70T-1FBG676IXC7K70T-1FB484IXC7K70T-2FB484IXC7K70T-1FB676IXC7K70T-1FBG484IXC7K70T-2FBG484I

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