XC7K325T-1FFG900I
AMD Xilinx Kintex-7 FPGA
326K logic cells 900-ball BGA Industrial
AvailableLifecycle: Active
The XC7K325T-1FFG900I is an AMD Xilinx Kintex-7 FPGA based on the XC7K325T device, with 326,080 logic cells, 16,020 Kb of block RAM and 840 DSP slices. It comes in the FFG900 package (900-FCBGA, 31 × 31 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.0 V core supply (VCCINT) and has 500 user I/O in this package. It is in active production.
- Logic Cells
- 326,080
- Block RAM
- 16,020 Kb
- DSP slices
- 840
- Balls
- 900
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC7K325T-1FFG900I
- Base device
- XC7K325T
- Family
- Kintex-7
- Package
- FFG900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 1.0 V
- Product status
- Active
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic Cells
- 326,080
- DSP slices
- 840
- Block RAM
- 16,020 Kb
- Transceivers
- 16
- User I/O (FFG900)
- 500
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- Mounting
- Surface Mount
- LABs / CLBs
- 25,475
- Supply voltage
- 0.97 V to 1.03 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Kintex-7
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC7K325T | Base Device | Kintex-7 device XC7K325T |
| 1 | Speed Grade | Speed grade 1 |
| FFG900 | Package | 900-pin BGA (flip-chip ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XC7K325T-L2FBG900I datasheetAMD Xilinx document
- XC7K325T-2FF676I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC7K325T-1FFG900C | Engineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFG900 | -1 | Commercial |
| XC7K325T-1FF900I | Likely alternative · 83/100Leaded FF900 version of the lead-free FFG900 package | FF900 | -1 | Industrial |
| XC7K325T-1FF900C | Engineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Leaded FF900 version of the lead-free FFG900 package | FF900 | -1 | Commercial |
| XC7K325T-2FFG900I | Likely alternative · 89/100Faster -2 speed grade, same device and package | FFG900 | -2 | Industrial |
| XC7K325T-2FFG900C | Engineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | FFG900 | -2 | Commercial |
| XC7K325T-3FFG900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -3 speed grade, same device and package | FFG900 | -3 | Extended |
| XC7K410T-1FFG900I | Engineering review required · 71/100All 900 balls identical in the FFG900 package. Different device: the design must be rebuilt | FFG900 | -1 | Industrial |
| XC7K325T-1FB676C | Same device, different package | FB676 | -1 | Commercial |
| XC7K325T-1FB676I | Same device, different package | FB676 | -1 | Industrial |
| XC7K325T-1FB900C | Same device, different package | FB900 | -1 | Commercial |
| XC7K325T-1FB900I | Same device, different package | FB900 | -1 | Industrial |
| XC7K325T-1FBG676C | Same device, different package | FBG676 | -1 | Commercial |
| XC7K325T-1FBG676I | Same device, different package | FBG676 | -1 | Industrial |
| XC7K325T-2FBG676C | Same device, different package | FBG676 | -2 | Commercial |
| XC7K325T-2FBG676I | Same device, different package | FBG676 | -2 | Industrial |
| XC7K325T-3FBG676E | Same device, different package | FBG676 | -3 | Extended |
| XC7K325T-1FBG900C | Same device, different package | FBG900 | -1 | Commercial |
| XC7K325T-1FBG900I | Same device, different package | FBG900 | -1 | Industrial |
| XC7K325T-2FBG900C | Same device, different package | FBG900 | -2 | Commercial |
| XC7K325T-2FBG900I | Same device, different package | FBG900 | -2 | Industrial |
| XC7K325T-1FF676I | Same device, different package | FF676 | -1 | Industrial |
| XC7K325T-2FF676I | Same device, different package | FF676 | -2 | Industrial |
| XC7K325T-2FF900C | Same device, different package | FF900 | -2 | Commercial |
| XC7K325T-2FF900I | Same device, different package | FF900 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC7K325T-1FFG900I still in production?
- Yes. The XC7K325T-1FFG900I is in active production.
- What package is the XC7K325T-1FFG900I?
- The XC7K325T-1FFG900I comes in the FFG900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XC7K325T come in industrial temperature?
- The XC7K325T-1FFG900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 19 other XC7K325T parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC7K325T-2FFG900IXC7K325T-1FB676IXC7K325T-1FB900IXC7K325T-1FBG676IXC7K325T-2FBG676IXC7K325T-1FBG900IXC7K325T-2FBG900IXC7K325T-1FF676Iand 11 more
Guides and comparisons
Need XC7K325T-1FFG900I?
Send the quantity and we'll check current market availability, pricing and lead time.
Check Stock & Pricing