XC3SD1800A-4FGG676I
AMD Xilinx Spartan-3 FPGA
37K logic cells 676-ball Industrial
AvailableNotice: XCN23009
The XC3SD1800A-4FGG676I is an AMD Xilinx Spartan-3 FPGA based on the XC3SD1800A device, with 37,440 logic cells and 1,512 Kb of block RAM. It comes in the FGG676 package (676-FBGA, 27 × 27 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction).
- Logic cells
- 37,440
- Block RAM
- 1,512 Kb
- Pins
- 676
- Speed grade
- 4
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3SD1800A-4FGG676I
- Base device
- XC3SD1800A
- Family
- Spartan-3
- Package
- FGG676
- Pin / ball count
- 676
- Speed grade
- 4
- Temperature grade
- Industrial
- Manufacturer notice
- XCN23009
Device specifications
- Logic cells
- 37,440
- Block RAM
- 1,512 Kb
Specifications
- Package outline
- 676-FBGA, 27 × 27 mm
- Package / case
- 676-BGA
- Mounting
- Surface Mount
- User I/O
- 519
- LABs / CLBs
- 4,160
- System gates
- 1,800,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- -40 °C to 100 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3SD1800A | Base Device | Spartan-3 device XC3SD1800A |
| 4 | Speed Grade | Speed grade 4 |
| FGG676 | Package | 676-pin BGA (fine-pitch ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XC3SD1800A-4FGG676I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3SD1800A-4CS484C | Same device, different package | CS484 | -4 | Commercial |
| XC3SD1800A-4CS484I | Same device, different package | CS484 | -4 | Industrial |
| XC3SD1800A-5CS484C | Same device, different package | CS484 | -5 | Commercial |
| XC3SD1800A-4CSG484C | Same device, different package | CSG484 | -4 | Commercial |
| XC3SD1800A-4CSG484I | Same device, different package | CSG484 | -4 | Industrial |
| XC3SD1800A-5CSG484C | Same device, different package | CSG484 | -5 | Commercial |
| XC3SD1800A-4FG676C | Same device, different package | FG676 | -4 | Commercial |
| XC3SD1800A-4FG676I | Same device, different package | FG676 | -4 | Industrial |
| XC3SD1800A-5FG676C | Same device, different package | FG676 | -5 | Commercial |
| XC3SD1800A-4FGG676C | Same device, commercial temperature | FGG676 | -4 | Commercial |
| XC3SD1800A-5FGG676C | Same device, different speed and temperature grade | FGG676 | -5 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is there a direct replacement for the XC3SD1800A-4FGG676I?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3SD1800A-4FGG676I. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XC3SD1800A-4FGG676I?
- The XC3SD1800A-4FGG676I comes in the FGG676 package (676-FBGA, 27 × 27 mm).
- Which versions of the XC3SD1800A come in industrial temperature?
- The XC3SD1800A-4FGG676I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 3 other XC3SD1800A parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3SD1800A-4CS484IXC3SD1800A-4CSG484IXC3SD1800A-4FG676I
XC3SD1800A discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3SD1800A replacement optionsGuides and comparisons
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