XC3S5000-4FG676C
AMD Xilinx Spartan-3 FPGA
75K logic cells Commercial
AvailableNotice: XCN23009
The XC3S5000-4FG676C is an AMD Xilinx Spartan-3 FPGA based on the XC3S5000 device, with 74,880 logic cells and 1,872 Kb of block RAM. It comes in the FG676 package, speed grade 4, commercial temperature. It runs from a 1.2 V core supply (VCCINT).
- Logic cells
- 74,880
- Block RAM
- 1,872 Kb
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S5000-4FG676C
- Base device
- XC3S5000
- Family
- Spartan-3
- Package
- FG676
- Speed grade
- 4
- Temperature grade
- Commercial
- Core supply (VCCINT)
- 1.2 V
- Manufacturer notice
- XCN23009
- ECCN
- 3A991.d
- HTS code
- 8542310060
Device specifications
- Logic cells
- 74,880
- Block RAM
- 1,872 Kb
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S5000 | Base Device | Spartan-3 device XC3S5000 |
| 4 | Speed Grade | Speed grade 4 |
| FG676 | Package | 676-pin BGA (fine-pitch ball grid array) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S5000-5FGG676C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S5000-4FG676I | Very strong alternative · 98/100Same device, package and speed grade. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C) | FG676 | -4 | Industrial |
| XC3S5000-4FGG676C | Likely alternative · 83/100Lead-free FGG676 version of the leaded FG676 package | FGG676 | -4 | Commercial |
| XC3S5000-4FGG676I | Likely alternative · 83/100Lead-free FGG676 version of the leaded FG676 package. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C) | FGG676 | -4 | Industrial |
| XC3S5000-5FG676C | Strong SKU alternate · 91/100Faster -5 speed grade, same device and package | FG676 | -5 | Commercial |
| XC3S5000-4FG1156C | Same device, different package | FG1156 | -4 | Commercial |
| XC3S5000-4FG1156I | Same device, different package | FG1156 | -4 | Industrial |
| XC3S5000-5FG1156C | Same device, different package | FG1156 | -5 | Commercial |
| XC3S5000-4FG900C | Same device, different package | FG900 | -4 | Commercial |
| XC3S5000-4FG900I | Same device, different package | FG900 | -4 | Industrial |
| XC3S5000-5FG900C | Same device, different package | FG900 | -5 | Commercial |
| XC3S5000-4FGG1156C | Same device, different package | FGG1156 | -4 | Commercial |
| XC3S5000-4FGG1156I | Same device, different package | FGG1156 | -4 | Industrial |
| XC3S5000-5FGG676C | Same device, different package | FGG676 | -5 | Commercial |
| XC3S5000-4FGG900C | Same device, different package | FGG900 | -4 | Commercial |
| XC3S5000-4FGG900I | Same device, different package | FGG900 | -4 | Industrial |
| XC3S5000-5FGG900C | Same device, different package | FGG900 | -5 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is there a direct replacement for the XC3S5000-4FG676C?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S5000-4FG676C. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XC3S5000-4FG676C?
- The XC3S5000-4FG676C comes in the FG676 package.
- Which versions of the XC3S5000 come in industrial temperature?
- The XC3S5000-4FG676C is not an industrial-temperature part. 6 XC3S5000 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S5000-4FG676IXC3S5000-4FG1156IXC3S5000-4FG900IXC3S5000-4FGG1156IXC3S5000-4FGG676IXC3S5000-4FGG900I
XC3S5000 discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S5000 replacement optionsGuides and comparisons
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