XC3S4000L-4FGG900C
AMD Xilinx Spartan-3 FPGA
62K logic cells 900-ball Commercial
Available
The XC3S4000L-4FGG900C is an AMD Xilinx Spartan-3 FPGA based on the XC3S4000L device, with 62,208 logic cells and 1,728 Kb of block RAM. It comes in the FGG900 package (900-FBGA, 31 × 31 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction).
- Logic cells
- 62,208
- Block RAM
- 1,728 Kb
- Pins
- 900
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S4000L-4FGG900C
- Base device
- XC3S4000L
- Family
- Spartan-3
- Package
- FGG900
- Pin / ball count
- 900
- Speed grade
- 4
- Temperature grade
- Commercial
Device specifications
- Logic cells
- 62,208
- Block RAM
- 1,728 Kb
Specifications
- Package outline
- 900-FBGA, 31 × 31 mm
- Package / case
- 900-BBGA
- Mounting
- Surface Mount
- User I/O
- 633
- LABs / CLBs
- 1,728
- System gates
- 4,000,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S4000L | Base Device | Spartan-3 device XC3S4000L |
| 4 | Speed Grade | Speed grade 4 |
| FGG900 | Package | 900-pin BGA (fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S4000L-4FGG900C datasheetAMD Xilinx document
Frequently asked questions
- What package is the XC3S4000L-4FGG900C?
- The XC3S4000L-4FGG900C comes in the FGG900 package (900-FBGA, 31 × 31 mm).
XC3S4000L discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S4000L replacement optionsGuides and comparisons
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