FPGA Market

XC3S4000-5FGG900C

AMD Xilinx Spartan-3 FPGA

62K logic cells 900-ball Commercial

AvailableNotice: XCN23009

The XC3S4000-5FGG900C is an AMD Xilinx Spartan-3 FPGA based on the XC3S4000 device, with 62,208 logic cells and 1,728 Kb of block RAM. It comes in the FGG900 package (900-FBGA, 31 × 31 mm), speed grade 5, commercial temperature (0 °C to 85 °C, junction). It runs from a 1.2 V core supply (VCCINT).

Logic cells
62,208
Block RAM
1,728 Kb
Pins
900
Speed grade
5
Temperature
Commercial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S4000-5FGG900C
Base device
XC3S4000
Family
Spartan-3
Package
FGG900
Pin / ball count
900
Speed grade
5
Temperature grade
Commercial
Core supply (VCCINT)
1.2 V
Manufacturer notice
XCN23009

Device specifications

Logic cells
62,208
Block RAM
1,728 Kb

Specifications

Package outline
900-FBGA, 31 × 31 mm
Package / case
900-BBGA
Mounting
Surface Mount
User I/O
633
LABs / CLBs
6,912
System gates
4,000,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
0 °C to 85 °C (junction)

Part number breakdown

SegmentFieldMeaning
XC3S4000Base DeviceSpartan-3 device XC3S4000
5Speed GradeSpeed grade 5
FGG900Package900-pin BGA (fine-pitch ball grid array, Pb-free)
CTemperature GradeCommercial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S4000-5FG900CLikely alternative · 83/100Leaded FG900 version of the lead-free FGG900 packageFG900-5Commercial
XC3S4000-4FGG900CEngineering review required · 71/100Slower -4 speed grade: timing must be re-closedFGG900-4Commercial
XC3S4000-4FGG900IEngineering review required · 71/100Slower -4 speed grade: timing must be re-closed. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C)FGG900-4Industrial
XC3S4000-4FG1156CSame device, different packageFG1156-4Commercial
XC3S4000-5FG1156CSame device, different packageFG1156-5Commercial
XC3S4000-4FG676CSame device, different packageFG676-4Commercial
XC3S4000-4FG676ISame device, different packageFG676-4Industrial
XC3S4000-5FG676CSame device, different packageFG676-5Commercial
XC3S4000-4FG900CSame device, different packageFG900-4Commercial
XC3S4000-4FG900ISame device, different packageFG900-4Industrial
XC3S4000-4FGG1156ISame device, different packageFGG1156-4Industrial
XC3S4000-5FGG1156CSame device, different packageFGG1156-5Commercial
XC3S4000-4FGG676CSame device, different packageFGG676-4Commercial
XC3S4000-4FGG676ISame device, different packageFGG676-4Industrial
XC3S4000-5FGG676CSame device, different packageFGG676-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is there a direct replacement for the XC3S4000-5FGG900C?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S4000-5FGG900C. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S4000-5FGG900C?
The XC3S4000-5FGG900C comes in the FGG900 package (900-FBGA, 31 × 31 mm).
Which versions of the XC3S4000 come in industrial temperature?
The XC3S4000-5FGG900C is not an industrial-temperature part. 5 XC3S4000 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S4000-4FGG900IXC3S4000-4FG676IXC3S4000-4FG900IXC3S4000-4FGG1156IXC3S4000-4FGG676I

XC3S4000 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S4000 replacement options

Guides and comparisons

Need XC3S4000-5FGG900C?

Send the quantity and we'll check current market availability, pricing and lead time.

Check Stock & Pricing