XC3S200AN-5FT256C
AMD Xilinx Spartan-3 FPGA
4K logic cells 256-ball Commercial
The XC3S200AN-5FT256C is an AMD Xilinx Spartan-3 FPGA based on the XC3S200AN device, with 4,032 logic cells and 288 Kb of block RAM. It comes in the FT256 package (256-FTBGA, 17 × 17 mm), speed grade 5, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 4,032
- Block RAM
- 288 Kb
- Pins
- 256
- Speed grade
- 5
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S200AN-5FT256C
- Base device
- XC3S200AN
- Family
- Spartan-3
- Package
- FT256
- Pin / ball count
- 256
- Speed grade
- 5
- Temperature grade
- Commercial
- Product status
- Obsolete
- Manufacturer notice
- XCN23009
- ECCN
- EAR99
- HTS code
- 8542.31.0060
- RoHS
- Not compliant
Device specifications
- Logic cells
- 4,032
- Block RAM
- 288 Kb
Specifications
- Package outline
- 256-FTBGA, 17 × 17 mm
- Package / case
- 256-LBGA
- Mounting
- Surface Mount
- User I/O
- 195
- LABs / CLBs
- 448
- System gates
- 200,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Spartan-3AN
- Last time buy
- 29 Jun 2024
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S200AN | Base Device | Spartan-3 device XC3S200AN |
| 5 | Speed Grade | Speed grade 5 |
| FT256 | Package | 256-pin BGA (thin fine-pitch ball grid array) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S200AN-4FTG256C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S200AN-4FT256C | Same device, different speed grade | FT256 | -4 | Commercial |
| XC3S200AN-4FT256I | Same device, different speed and temperature grade | FT256 | -4 | Industrial |
| XC3S200AN-5FT256I | Same device, industrial temperature | FT256 | -5 | Industrial |
| XC3S200AN-4FTG256C | Same device, different package | FTG256 | -4 | Commercial |
| XC3S200AN-4FTG256I | Same device, different package | FTG256 | -4 | Industrial |
| XC3S200AN-5FTG256C | Same device, different package | FTG256 | -5 | Commercial |
| XC3S200AN-5FTG256I | Same device, different package | FTG256 | -5 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC3S200AN-5FT256C still in production?
- No. The XC3S200AN-5FT256C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- Is there a direct replacement for the XC3S200AN-5FT256C?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S200AN-5FT256C. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XC3S200AN-5FT256C?
- The XC3S200AN-5FT256C comes in the FT256 package (256-FTBGA, 17 × 17 mm).
- Which versions of the XC3S200AN come in industrial temperature?
- The XC3S200AN-5FT256C is not an industrial-temperature part. 4 XC3S200AN parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S200AN-4FT256IXC3S200AN-5FT256IXC3S200AN-4FTG256IXC3S200AN-5FTG256I
XC3S200AN discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S200AN replacement optionsGuides and comparisons
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