FPGA Market

XC3S1600E-5FGG484C

AMD Xilinx Spartan-3 FPGA

33K logic cells 484-ball Commercial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC3S1600E-5FGG484C is an AMD Xilinx Spartan-3 FPGA based on the XC3S1600E device, with 33,192 logic cells and 648 Kb of block RAM. It comes in the FGG484 package (484-FBGA, 23 × 23 mm), speed grade 5, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
33,192
Block RAM
648 Kb
Pins
484
Speed grade
5
Temperature
Commercial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S1600E-5FGG484C
Base device
XC3S1600E
Family
Spartan-3
Package
FGG484
Pin / ball count
484
Speed grade
5
Temperature grade
Commercial
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Compliant

Device specifications

Logic cells
33,192
Block RAM
648 Kb

Specifications

Package outline
484-FBGA, 23 × 23 mm
Package / case
484-BBGA
Mounting
Surface Mount
User I/O
376
LABs / CLBs
3,688
System gates
1,600,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
0 °C to 85 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3E
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S1600EBase DeviceSpartan-3 device XC3S1600E
5Speed GradeSpeed grade 5
FGG484Package484-pin BGA (fine-pitch ball grid array, Pb-free)
CTemperature GradeCommercial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S1600E-4FG320CSame device, different packageFG320-4Commercial
XC3S1600E-4FG320ISame device, different packageFG320-4Industrial
XC3S1600E-5FG320CSame device, different packageFG320-5Commercial
XC3S1600E-4FG400CSame device, different packageFG400-4Commercial
XC3S1600E-4FG400ISame device, different packageFG400-4Industrial
XC3S1600E-5FG400CSame device, different packageFG400-5Commercial
XC3S1600E-4FG484CSame device, different packageFG484-4Commercial
XC3S1600E-4FG484ISame device, different packageFG484-4Industrial
XC3S1600E-5FG484CSame device, different packageFG484-5Commercial
XC3S1600E-4FGG320CSame device, different packageFGG320-4Commercial
XC3S1600E-4FGG320ISame device, different packageFGG320-4Industrial
XC3S1600E-5FGG320CSame device, different packageFGG320-5Commercial
XC3S1600E-4FGG400CSame device, different packageFGG400-4Commercial
XC3S1600E-4FGG400ISame device, different packageFGG400-4Industrial
XC3S1600E-5FGG400CSame device, different packageFGG400-5Commercial
XC3S1600E-4FGG484CSame device, different speed gradeFGG484-4Commercial
XC3S1600E-4FGG484ISame device, different speed and temperature gradeFGG484-4Industrial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S1600E-5FGG484C still in production?
No. The XC3S1600E-5FGG484C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC3S1600E-5FGG484C?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S1600E-5FGG484C. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S1600E-5FGG484C?
The XC3S1600E-5FGG484C comes in the FGG484 package (484-FBGA, 23 × 23 mm).
Which versions of the XC3S1600E come in industrial temperature?
The XC3S1600E-5FGG484C is not an industrial-temperature part. 6 XC3S1600E parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S1600E-4FGG484IXC3S1600E-4FG320IXC3S1600E-4FG400IXC3S1600E-4FG484IXC3S1600E-4FGG320IXC3S1600E-4FGG400I

XC3S1600E discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S1600E replacement options

Guides and comparisons

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