FPGA Market

XC3S1500-5FGG676C

AMD Xilinx Spartan-3 FPGA

30K logic cells 676-ball Commercial

AvailableNotice: XCN23009

The XC3S1500-5FGG676C is an AMD Xilinx Spartan-3 FPGA based on the XC3S1500 device, with 29,952 logic cells and 576 Kb of block RAM. It comes in the FGG676 package (676-FBGA, 27 × 27 mm), speed grade 5, commercial temperature (0 °C to 85 °C, junction). It runs from a 1.2 V core supply (VCCINT).

Logic cells
29,952
Block RAM
576 Kb
Pins
676
Speed grade
5
Temperature
Commercial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S1500-5FGG676C
Base device
XC3S1500
Family
Spartan-3
Package
FGG676
Pin / ball count
676
Speed grade
5
Temperature grade
Commercial
Core supply (VCCINT)
1.2 V
Manufacturer notice
XCN23009

Device specifications

Logic cells
29,952
Block RAM
576 Kb

Specifications

Package outline
676-FBGA, 27 × 27 mm
Package / case
676-BGA
Mounting
Surface Mount
User I/O
487
LABs / CLBs
3,328
System gates
1,500,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
0 °C to 85 °C (junction)

Part number breakdown

SegmentFieldMeaning
XC3S1500Base DeviceSpartan-3 device XC3S1500
5Speed GradeSpeed grade 5
FGG676Package676-pin BGA (fine-pitch ball grid array, Pb-free)
CTemperature GradeCommercial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S1500-5FG676CLikely alternative · 83/100Leaded FG676 version of the lead-free FGG676 packageFG676-5Commercial
XC3S1500-4FGG676CEngineering review required · 71/100Slower -4 speed grade: timing must be re-closedFGG676-4Commercial
XC3S1500-4FGG676IEngineering review required · 71/100Slower -4 speed grade: timing must be re-closed. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C)FGG676-4Industrial
XC3S1500-4FG320ISame device, different packageFG320-4Industrial
XC3S1500-5FG320CSame device, different packageFG320-5Commercial
XC3S1500-4FG456CSame device, different packageFG456-4Commercial
XC3S1500-4FG456ISame device, different packageFG456-4Industrial
XC3S1500-5FG456CSame device, different packageFG456-5Commercial
XC3S1500-4FG676CSame device, different packageFG676-4Commercial
XC3S1500-4FG676ISame device, different packageFG676-4Industrial
XC3S1500-4FGG320CSame device, different packageFGG320-4Commercial
XC3S1500-4FGG320ISame device, different packageFGG320-4Industrial
XC3S1500-5FGG320CSame device, different packageFGG320-5Commercial
XC3S1500-4FGG456CSame device, different packageFGG456-4Commercial
XC3S1500-4FGG456ISame device, different packageFGG456-4Industrial
XC3S1500-5FGG456CSame device, different packageFGG456-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is there a direct replacement for the XC3S1500-5FGG676C?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S1500-5FGG676C. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S1500-5FGG676C?
The XC3S1500-5FGG676C comes in the FGG676 package (676-FBGA, 27 × 27 mm).
Which versions of the XC3S1500 come in industrial temperature?
The XC3S1500-5FGG676C is not an industrial-temperature part. 6 XC3S1500 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S1500-4FGG676IXC3S1500-4FG320IXC3S1500-4FG456IXC3S1500-4FG676IXC3S1500-4FGG320IXC3S1500-4FGG456I

XC3S1500 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S1500 replacement options

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