FPGA Market

XC3S1400A-4FG676I

AMD Xilinx Spartan-3 FPGA

25K logic cells 676-ball Industrial

AvailableLifecycle: End of LifeNotice: XCN23009

The XC3S1400A-4FG676I is an AMD Xilinx Spartan-3 FPGA based on the XC3S1400A device, with 25,344 logic cells and 576 Kb of block RAM. It comes in the FG676 package (676-FBGA, 27 × 27 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). The manufacturer has announced end of life for this part. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
25,344
Block RAM
576 Kb
Pins
676
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S1400A-4FG676I
Base device
XC3S1400A
Family
Spartan-3
Package
FG676
Pin / ball count
676
Speed grade
4
Temperature grade
Industrial
Product status
End of Life
Manufacturer notice
XCN23009
ECCN
3A001A7A
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
25,344
Block RAM
576 Kb

Specifications

Package outline
676-FBGA, 27 × 27 mm
Package / case
676-BGA
Mounting
Surface Mount
User I/O
502
LABs / CLBs
2,816
System gates
1,400,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3A
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S1400ABase DeviceSpartan-3 device XC3S1400A
4Speed GradeSpeed grade 4
FG676Package676-pin BGA (fine-pitch ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S1400A-4FG484CSame device, different packageFG484-4Commercial
XC3S1400A-4FG484ISame device, different packageFG484-4Industrial
XC3S1400A-4FG676CSame device, commercial temperatureFG676-4Commercial
XC3S1400A-4FGG484CSame device, different packageFGG484-4Commercial
XC3S1400A-4FGG484ISame device, different packageFGG484-4Industrial
XC3S1400A-5FGG484CSame device, different packageFGG484-5Commercial
XC3S1400A-4FGG676CSame device, different packageFGG676-4Commercial
XC3S1400A-4FGG676ISame device, different packageFGG676-4Industrial
XC3S1400A-5FGG676CSame device, different packageFGG676-5Commercial
XC3S1400A-4FT256ISame device, different packageFT256-4Industrial
XC3S1400A-4FTG256CSame device, different packageFTG256-4Commercial
XC3S1400A-4FTG256ISame device, different packageFTG256-4Industrial
XC3S1400A-5FTG256CSame device, different packageFTG256-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S1400A-4FG676I still in production?
The manufacturer has announced end of life for the XC3S1400A-4FG676I. Request a quote to check remaining stock — send the quantity you need.
Is there a direct replacement for the XC3S1400A-4FG676I?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S1400A-4FG676I. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S1400A-4FG676I?
The XC3S1400A-4FG676I comes in the FG676 package (676-FBGA, 27 × 27 mm).
Which versions of the XC3S1400A come in industrial temperature?
The XC3S1400A-4FG676I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC3S1400A parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S1400A-4FG484IXC3S1400A-4FGG484IXC3S1400A-4FGG676IXC3S1400A-4FT256IXC3S1400A-4FTG256I

XC3S1400A discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S1400A replacement options

Guides and comparisons

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