FPGA Market

XC3S1200E-4FG400I

AMD Xilinx Spartan-3 FPGA

20K logic cells 400-ball Industrial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC3S1200E-4FG400I is an AMD Xilinx Spartan-3 FPGA based on the XC3S1200E device, with 19,512 logic cells and 504 Kb of block RAM. It comes in the FG400 package (400-FBGA, 21 × 21 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
19,512
Block RAM
504 Kb
Pins
400
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S1200E-4FG400I
Base device
XC3S1200E
Family
Spartan-3
Package
FG400
Pin / ball count
400
Speed grade
4
Temperature grade
Industrial
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
19,512
Block RAM
504 Kb

Specifications

Package outline
400-FBGA, 21 × 21 mm
Package / case
400-BGA
Mounting
Surface Mount
User I/O
304
LABs / CLBs
2,168
System gates
1,200,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3E
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S1200EBase DeviceSpartan-3 device XC3S1200E
4Speed GradeSpeed grade 4
FG400Package400-pin BGA (fine-pitch ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S1200E-4FG320CSame device, different packageFG320-4Commercial
XC3S1200E-4FG320ISame device, different packageFG320-4Industrial
XC3S1200E-5FG320CSame device, different packageFG320-5Commercial
XC3S1200E-4FG400CSame device, commercial temperatureFG400-4Commercial
XC3S1200E-5FG400CSame device, different speed and temperature gradeFG400-5Commercial
XC3S1200E-4FGG320CSame device, different packageFGG320-4Commercial
XC3S1200E-4FGG320ISame device, different packageFGG320-4Industrial
XC3S1200E-5FGG320CSame device, different packageFGG320-5Commercial
XC3S1200E-4FGG400CSame device, different packageFGG400-4Commercial
XC3S1200E-4FGG400ISame device, different packageFGG400-4Industrial
XC3S1200E-5FGG400CSame device, different packageFGG400-5Commercial
XC3S1200E-4FT256CSame device, different packageFT256-4Commercial
XC3S1200E-4FT256ISame device, different packageFT256-4Industrial
XC3S1200E-5FT256CSame device, different packageFT256-5Commercial
XC3S1200E-4FTG256CSame device, different packageFTG256-4Commercial
XC3S1200E-4FTG256ISame device, different packageFTG256-4Industrial
XC3S1200E-5FTG256CSame device, different packageFTG256-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S1200E-4FG400I still in production?
No. The XC3S1200E-4FG400I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC3S1200E-4FG400I?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S1200E-4FG400I. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S1200E-4FG400I?
The XC3S1200E-4FG400I comes in the FG400 package (400-FBGA, 21 × 21 mm).
Which versions of the XC3S1200E come in industrial temperature?
The XC3S1200E-4FG400I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC3S1200E parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S1200E-4FG320IXC3S1200E-4FGG320IXC3S1200E-4FGG400IXC3S1200E-4FT256IXC3S1200E-4FTG256I

XC3S1200E discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S1200E replacement options

Guides and comparisons

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