XC3S1000L-4FGG676C
AMD Xilinx Spartan-3 FPGA
17K logic cells 676-ball Commercial
The XC3S1000L-4FGG676C is an AMD Xilinx Spartan-3 FPGA based on the XC3S1000L device, with 17,280 logic cells and 432 Kb of block RAM. It comes in the FGG676 package (676-FBGA, 27 × 27 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 17,280
- Block RAM
- 432 Kb
- Pins
- 676
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S1000L-4FGG676C
- Base device
- XC3S1000L
- Family
- Spartan-3
- Package
- FGG676
- Pin / ball count
- 676
- Speed grade
- 4
- Temperature grade
- Commercial
- Product status
- Obsolete
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Not compliant
Device specifications
- Logic cells
- 17,280
- Block RAM
- 432 Kb
Specifications
- Package outline
- 676-FBGA, 27 × 27 mm
- Package / case
- 676-BGA
- Mounting
- Surface Mount
- User I/O
- 391
- LABs / CLBs
- 480
- System gates
- 1,000,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Spartan-3L
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S1000L | Base Device | Spartan-3 device XC3S1000L |
| 4 | Speed Grade | Speed grade 4 |
| FGG676 | Package | 676-pin BGA (fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S1000L-4FTG256C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S1000L-4FG320C | Same device, different package | FG320 | -4 | Commercial |
| XC3S1000L-4FG456C | Same device, different package | FG456 | -4 | Commercial |
| XC3S1000L-4FG676C | Same device, different package | FG676 | -4 | Commercial |
| XC3S1000L-4FGG320C | Same device, different package | FGG320 | -4 | Commercial |
| XC3S1000L-4FGG456C | Same device, different package | FGG456 | -4 | Commercial |
| XC3S1000L-4FT256C | Same device, different package | FT256 | -4 | Commercial |
| XC3S1000L-4FTG256C | Same device, different package | FTG256 | -4 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC3S1000L-4FGG676C still in production?
- No. The XC3S1000L-4FGG676C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- What package is the XC3S1000L-4FGG676C?
- The XC3S1000L-4FGG676C comes in the FGG676 package (676-FBGA, 27 × 27 mm).
XC3S1000L discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S1000L replacement optionsGuides and comparisons
Need XC3S1000L-4FGG676C?
Send the quantity and we'll check current market availability, pricing and lead time.
Check Stock & Pricing