FPGA Market

XC2S50-5FGG256I

AMD Xilinx Spartan-II FPGA

2K logic cells 256-ball Industrial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC2S50-5FGG256I is an AMD Xilinx Spartan-II FPGA based on the XC2S50 device, with 1,728 logic cells and 32 Kb of block RAM. It comes in the FGG256 package (256-FBGA, 17 × 17 mm), speed grade 5, industrial temperature (-40 °C to 100 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
1,728
Block RAM
32 Kb
Pins
256
Speed grade
5
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC2S50-5FGG256I
Base device
XC2S50
Family
Spartan-II
Package
FGG256
Pin / ball count
256
Speed grade
5
Temperature grade
Industrial
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
EAR99
HTS code
8542.31.0060
RoHS
Compliant

Device specifications

Logic cells
1,728
Block RAM
32 Kb

Specifications

Package outline
256-FBGA, 17 × 17 mm
Package / case
256-BGA
Mounting
Surface Mount
User I/O
176
LABs / CLBs
384
System gates
50,000
Supply voltage
2.375 V to 2.625 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-II
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC2S50Base DeviceSpartan-II device XC2S50
5Speed GradeSpeed grade 5
FGG256Package256-pin BGA (fine-pitch ball grid array, Pb-free)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC2S50-5FG256CSame device, different packageFG256-5Commercial
XC2S50-5FG256ISame device, different packageFG256-5Industrial
XC2S50-6FG256CSame device, different packageFG256-6Commercial
XC2S50-5FGG256CSame device, commercial temperatureFGG256-5Commercial
XC2S50-6FGG256CSame device, different speed and temperature gradeFGG256-6Commercial
XC2S50-5PQ208CSame device, different packagePQ208-5Commercial
XC2S50-5PQ208ISame device, different packagePQ208-5Industrial
XC2S50-6PQ208CSame device, different packagePQ208-6Commercial
XC2S50-5PQG208CSame device, different packagePQG208-5Commercial
XC2S50-5PQG208ISame device, different packagePQG208-5Industrial
XC2S50-6PQG208CSame device, different packagePQG208-6Commercial
XC2S50-5TQ144CSame device, different packageTQ144-5Commercial
XC2S50-5TQ144ISame device, different packageTQ144-5Industrial
XC2S50-6TQ144CSame device, different packageTQ144-6Commercial
XC2S50-5TQG144CSame device, different packageTQG144-5Commercial
XC2S50-5TQG144ISame device, different packageTQG144-5Industrial
XC2S50-6TQG144CSame device, different packageTQG144-6Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC2S50-5FGG256I still in production?
No. The XC2S50-5FGG256I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC2S50-5FGG256I?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC2S50-5FGG256I. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC2S50-5FGG256I?
The XC2S50-5FGG256I comes in the FGG256 package (256-FBGA, 17 × 17 mm).
Which versions of the XC2S50 come in industrial temperature?
The XC2S50-5FGG256I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC2S50 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC2S50-5FG256IXC2S50-5PQ208IXC2S50-5PQG208IXC2S50-5TQ144IXC2S50-5TQG144I

XC2S50 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC2S50 replacement options

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