XA3S1600E-4FGG400I
AMD Xilinx Spartan-3 FPGA
33K logic cells 400-ball Industrial
The XA3S1600E-4FGG400I is an AMD Xilinx Spartan-3 FPGA based on the XA3S1600E device, with 33,192 logic cells and 648 Kb of block RAM. It comes in the FGG400 package (400-FBGA, 21 × 21 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). It is qualified to AEC-Q100. It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 33,192
- Block RAM
- 648 Kb
- Pins
- 400
- Speed grade
- 4
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XA3S1600E-4FGG400I
- Base device
- XA3S1600E
- Family
- Spartan-3
- Package
- FGG400
- Pin / ball count
- 400
- Speed grade
- 4
- Temperature grade
- Industrial
- Qualification
- AEC-Q100
- Product status
- Obsolete
- Manufacturer notice
- XCN23009
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic cells
- 33,192
- Block RAM
- 648 Kb
Specifications
- Package outline
- 400-FBGA, 21 × 21 mm
- Package / case
- 400-BGA
- Mounting
- Surface Mount
- User I/O
- 304
- LABs / CLBs
- 3,688
- System gates
- 1,600,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Grade
- Automotive
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Spartan-3E XA
- Last time buy
- 29 Jun 2024
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XA3S1600E | Base Device | Spartan-3 device XA3S1600E |
| 4 | Speed Grade | Speed grade 4 |
| FGG400 | Package | 400-pin BGA (fine-pitch ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XA3S1600E-4FGG484Q datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XA3S1600E-4FG400I | Same device, different package | FG400 | -4 | Industrial |
| XA3S1600E-4FGG400Q | Same device, automotive temperature | FGG400 | -4 | Automotive |
| XA3S1600E-4FGG484I | Same device, different package | FGG484 | -4 | Industrial |
| XA3S1600E-4FGG484Q | Same device, different package | FGG484 | -4 | Automotive |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XA3S1600E-4FGG400I still in production?
- No. The XA3S1600E-4FGG400I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- Is there a direct replacement for the XA3S1600E-4FGG400I?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XA3S1600E-4FGG400I. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XA3S1600E-4FGG400I?
- The XA3S1600E-4FGG400I comes in the FGG400 package (400-FBGA, 21 × 21 mm).
- Which versions of the XA3S1600E come in industrial temperature?
- The XA3S1600E-4FGG400I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 2 other XA3S1600E parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XA3S1600E-4FG400IXA3S1600E-4FGG484I
XA3S1600E discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XA3S1600E replacement optionsGuides and comparisons
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