FPGA Market

Obsolete device

XCV50E replacement options

The AMD Xilinx XCV50E has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

1. Keep the design — source the XCV50E

Discontinued parts are still traded. We hold 14 orderable XCV50E parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XCV50E-6CS144CCS1441446Commercial
XCV50E-6CS144ICS1441446Industrial
XCV50E-7CS144CCS1441447Commercial
XCV50E-7CS144ICS1441447Industrial
XCV50E-8CS144CCS1441448Commercial
XCV50E-6FG256CFG2562566Commercial
XCV50E-6FG256IFG2562566Industrial
XCV50E-7FG256CFG2562567Commercial
XCV50E-7FG256IFG2562567Industrial
XCV50E-6PQ240CPQ2402406Commercial
XCV50E-6PQ240IPQ2402406Industrial
XCV50E-7PQ240CPQ2402407Commercial
XCV50E-7PQ240IPQ2402407Industrial
XCV50E-8PQ240CPQ2402408Commercial

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XCV50E, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XCV50EBlock RAMDSPParts
XCV50EVirtex-E 1.8V1,728The original64 Kb14
XC7S6Spartan-76,0003.5× the logic cells180 Kb1014
XA7S6Spartan-76,0003.5× the logic cells180 Kb102

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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