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Obsolete device

XCV300E replacement options

The AMD Xilinx XCV300E has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 58 XCV300E parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

From the manufacturer's discontinuation notice: Product Discontinuation Notice: Spartan-IIE, Virtex-E, Virtex-EM, Virtex-II, EasyPath Virt

1. Keep the design — source the XCV300E

Discontinued parts are still traded. We hold 45 orderable XCV300E parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XCV300E-6BG352CBG3523526Commercial
XCV300E-6BG352IBG3523526Industrial
XCV300E-7BG352CBG3523527Commercial
XCV300E-7BG352IBG3523527Industrial
XCV300E-8BG352CBG3523528Commercial
XCV300E-6BG432CBG4324326Commercial
XCV300E-6BG432IBG4324326Industrial
XCV300E-7BG432CBG4324327Commercial
XCV300E-7BG432IBG4324327Industrial
XCV300E-8BG432CBG4324328Commercial
XCV300E-6BGG352CBGG3523526Commercial
XCV300E-6BGG352IBGG3523526Industrial
XCV300E-7BGG352CBGG3523527Commercial
XCV300E-7BGG352IBGG3523527Industrial
XCV300E-8BGG352CBGG3523528Commercial
XCV300E-6BGG432IBGG4326Industrial

All 45 XCV300E parts

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XCV300E, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XCV300EBlock RAMDSPParts
XCV300EVirtex-E 1.8V6,912The original128 Kb45
XCSU10PSpartan UltraScale+10,9381.6× the logic cells1,728 Kb245
XC7S15Spartan-712,8001.9× the logic cells360 Kb2018
XC7A12TArtix-712,8001.9× the logic cells720 Kb4014
XA7A12TArtix-712,8001.9× the logic cells720 Kb2
XA7S15Spartan-712,8001.9× the logic cells360 Kb202
XC7A15TArtix-716,6402.4× the logic cells900 Kb4531

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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