FPGA Market

Obsolete device

XCV200E replacement options

The AMD Xilinx XCV200E has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 65 XCV200E parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

From the manufacturer's discontinuation notice: Retracted (XCN11003) - To communicate that the Xilinx discontinuation of certain Virtex (V

1. Keep the design — source the XCV200E

Discontinued parts are still traded. We hold 44 orderable XCV200E parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XCV200E-6BG352CBG3523526Commercial
XCV200E-7BG352CBG3523527Commercial
XCV200E-7BG352IBG3523527Industrial
XCV200E-8BG352CBG3523528Commercial
XCV200E-6BGG352IBGG3523526Industrial
XCV200E-7BGG352CBGG3523527Commercial
XCV200E-7BGG352IBGG3523527Industrial
XCV200E-8BGG352CBGG3523528Commercial
XCV200E-6CS144CCS1441446Commercial
XCV200E-6CS144ICS1441446Industrial
XCV200E-7CS144CCS1441447Commercial
XCV200E-7CS144ICS1441447Industrial
XCV200E-8CS144CCS1441448Commercial
XCV200E-6CSG144CCSG1441446Commercial
XCV200E-6CSG144ICSG1441446Industrial
XCV200E-7CSG144CCSG1441447Commercial

All 44 XCV200E parts

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XCV200E, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XCV200EBlock RAMDSPParts
XCV200EVirtex-E 1.8V5,292The original112 Kb44
XC7S6Spartan-76,0001.1× the logic cells180 Kb1016
XA7S6Spartan-76,0001.1× the logic cells180 Kb104
XCSU10PSpartan UltraScale+10,9382.1× the logic cells1,728 Kb245
XC7S15Spartan-712,8002.4× the logic cells360 Kb2018
XC7A12TArtix-712,8002.4× the logic cells720 Kb4014
XA7A12TArtix-712,8002.4× the logic cells720 Kb2

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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