FPGA Market

Obsolete device

XCR3512XL replacement options

The AMD Xilinx XCR3512XL has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 16 XCR3512XL parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

“The affected devices and their recommended replacement part numbers are shown in XC9500XL Devices Affected and CoolRunner-II Devices Affected . © Copyright 2007-2009 Xilinx, Inc.”
AMD Xilinx, in its notice: CPLD Part Number Changes: XC to XA for Automotive Customers (XCN07016) - To communicate a

From the manufacturer's discontinuation notice: Product Discontinuation Notice for XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II,

1. Keep the design — source the XCR3512XL

Discontinued parts are still traded. We hold 26 orderable XCR3512XL parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XCR3512XL-10FG324CFG32432410Commercial
XCR3512XL-10FG324IFG32432410Industrial
XCR3512XL-12FG324CFG32412Commercial
XCR3512XL-12FG324IFG32432412Industrial
XCR3512XL-7FG324CFG3247Commercial
XCR3512XL-10FGG324IFGG32432410Industrial
XCR3512XL-10FT256CFT25625610Commercial
XCR3512XL-10FT256IFT25625610Industrial
XCR3512XL-12FT256CFT25612Commercial
XCR3512XL-12FT256IFT25625612Industrial
XCR3512XL-7FT256CFT2562567Commercial
XCR3512XL-10FTG256CFTG25610Commercial
XCR3512XL-10FTG256IFTG25625610Industrial
XCR3512XL-12FTG256CFTG25625612Commercial
XCR3512XL-12FTG256IFTG25625612Industrial
XCR3512XL-7FTG256CFTG2562567Commercial

All 26 XCR3512XL parts

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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