FPGA Market

Obsolete device

XCR3256XL replacement options

The AMD Xilinx XCR3256XL has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 30 XCR3256XL parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

“The affected devices and their recommended replacement part numbers are shown in XC9500XL Devices Affected and CoolRunner-II Devices Affected . © Copyright 2007-2009 Xilinx, Inc.”
AMD Xilinx, in its notice: CPLD Part Number Changes: XC to XA for Automotive Customers (XCN07016) - To communicate a

From the manufacturer's discontinuation notice: Product Discontinuation Notice for XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II,

1. Keep the design — source the XCR3256XL

Discontinued parts are still traded. We hold 40 orderable XCR3256XL parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XCR3256XL-10CS280CCS28010Commercial
XCR3256XL-10CS280ICS28028010Industrial
XCR3256XL-12CS280CCS28012Commercial
XCR3256XL-12CS280ICS28012Industrial
XCR3256XL-7CS280CCS2807Commercial
XCR3256XL-10CSG280CCSG28010Commercial
XCR3256XL-10CSG280ICSG28028010Industrial
XCR3256XL-12CSG280CCSG28012Commercial
XCR3256XL-12CSG280ICSG28012Industrial
XCR3256XL-7CSG280CCSG2807Commercial
XCR3256XL-10FT256CFT25610Commercial
XCR3256XL-10FT256IFT25625610Industrial
XCR3256XL-12FT256CFT25625612Commercial
XCR3256XL-12FT256IFT25625612Industrial
XCR3256XL-7FT256CFT2562567Commercial
XCR3256XL-10FTG256CFTG25625610Commercial

All 40 XCR3256XL parts

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

Guides and comparisons