FPGA Market

Obsolete device

XC3S50 replacement options

The AMD Xilinx XC3S50 has been declared end of life by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 10 XC3S50 parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

From the manufacturer's discontinuation notice: Product Discontinuation Notice for XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II,

1. Keep the design — source the XC3S50

Discontinued parts are still traded. We hold 19 orderable XC3S50 parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XC3S50-4CP132CCP1324Commercial
XC3S50-5CP132CCP1325Commercial
XC3S50-4CPG132CCPG1321324Commercial
XC3S50-4CPG132ICPG1321324Industrial
XC3S50-5CPG132CCPG1321325Commercial
XC3S50-4PQ208CPQ2082084Commercial
XC3S50-4PQ208IPQ2082084Industrial
XC3S50-4PQG208CPQG2082084Commercial
XC3S50-4PQG208IPQG2082084Industrial
XC3S50-4TQ144CTQ1441444Commercial
XC3S50-4TQ144ITQ1441444Industrial
XC3S50-4TQG144CTQG1441444Commercial
XC3S50-4TQG144ITQG1441444Industrial
XC3S50-5TQG144CTQG1441445Commercial
XC3S50-4VQ100CVQ1001004Commercial
XC3S50-4VQ100IVQ1001004Industrial

All 19 XC3S50 parts

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XC3S50, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XC3S50Block RAMDSPParts
XC3S50Spartan-31,728The original72 Kb19
XC7S6Spartan-76,0003.5× the logic cells180 Kb1014
XA7S6Spartan-76,0003.5× the logic cells180 Kb102

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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