FPGA Market

XCZU5EG-3FBVB900C

AMD XilinxZynq UltraScale+ MPSoCFPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU5EG-3FBVB900C
Base device
XCZU5EG
Family
Zynq UltraScale+ MPSoC
Package
FBVB900
Package type
BGA
Pin / ball count
900
Speed grade
-3
Temperature grade
Commercial

Device specifications

System Logic Cells
256,000
DSP slices
1,248
Block RAM
27,238 Kb
Transceivers
16
Max transceiver rate
16.3 Gb/s
User I/O (FBVB900)
207
Processor
Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz

Part number breakdown

SegmentFieldMeaning
XCZU5EGBase DeviceZynq UltraScale+ MPSoC device XCZU5EG
3Speed GradeSpeed grade 3
FBVB900Package900-pin BGA (flip-chip ball grid array)
CTemperature GradeCommercial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU5EG-1FBVB900CSame device, different speed gradeFBVB900-1Commercial
XCZU5EG-1FBVB900ISame device, different speed and temperature gradeFBVB900-1Industrial
XCZU5EG-1FBVB900ESame device, different speed and temperature gradeFBVB900-1Extended
XCZU5EG-2FBVB900CSame device, different speed gradeFBVB900-2Commercial
XCZU5EG-2FBVB900ISame device, different speed and temperature gradeFBVB900-2Industrial
XCZU5EG-2FBVB900ESame device, different speed and temperature gradeFBVB900-2Extended
XCZU5EG-1SFVC784CSame device, different packageSFVC784-1Commercial
XCZU5EG-1SFVC784ISame device, different packageSFVC784-1Industrial
XCZU5EG-1SFVC784ESame device, different packageSFVC784-1Extended
XCZU5EG-2SFVC784CSame device, different packageSFVC784-2Commercial
XCZU5EG-2SFVC784ISame device, different packageSFVC784-2Industrial
XCZU5EG-2SFVC784ESame device, different packageSFVC784-2Extended
XCZU5EG-3SFVC784CSame device, different packageSFVC784-3Commercial

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