XCZU3TEG-3SFVC784C
AMD XilinxZynq UltraScale+SoC FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU3TEG-3SFVC784C
- Base device
- XCZU3TEG
- Family
- Zynq UltraScale+
- Package
- SFVC784
- Package type
- BGA
- Pin / ball count
- 784
- Speed grade
- -3
- Temperature grade
- Commercial
Device specifications
- System Logic Cells
- 157,000
- DSP slices
- 576
- Block RAM
- 21,708 Kb
- Transceivers
- 8
- Max transceiver rate
- 16.3 Gb/s
- User I/O (SFVC784)
- 125
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU3TEG | Base Device | Device XCZU3TEG |
| 3 | Speed Grade | Speed grade 3 |
| SFVC784 | Package | 784-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU3TEG-1SFVC784C | Same device, different speed grade | SFVC784 | -1 | Commercial |
| XCZU3TEG-1SFVC784I | Same device, different speed and temperature grade | SFVC784 | -1 | Industrial |
| XCZU3TEG-1SFVC784E | Same device, different speed and temperature grade | SFVC784 | -1 | Extended |
| XCZU3TEG-2SFVC784C | Same device, different speed grade | SFVC784 | -2 | Commercial |
| XCZU3TEG-2SFVC784I | Same device, different speed and temperature grade | SFVC784 | -2 | Industrial |
| XCZU3TEG-2SFVC784E | Same device, different speed and temperature grade | SFVC784 | -2 | Extended |
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