FPGA Market

XCZU3TCG-2SFVC784C

AMD XilinxZynq UltraScale+SoC FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU3TCG-2SFVC784C
Base device
XCZU3TCG
Family
Zynq UltraScale+
Package
SFVC784
Package type
BGA
Pin / ball count
784
Speed grade
-2
Temperature grade
Commercial

Device specifications

System Logic Cells
157,000
DSP slices
576
Block RAM
21,708 Kb
Transceivers
8
Max transceiver rate
16.3 Gb/s
User I/O (SFVC784)
125
Processor
Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz

Part number breakdown

SegmentFieldMeaning
XCZU3TCGBase DeviceDevice XCZU3TCG
2Speed GradeSpeed grade 2
SFVC784Package784-pin BGA (flip-chip ball grid array)
CTemperature GradeCommercial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU3TCG-1SFVC784CSame device, different speed gradeSFVC784-1Commercial
XCZU3TCG-1SFVC784ISame device, different speed and temperature gradeSFVC784-1Industrial
XCZU3TCG-1SFVC784ESame device, different speed and temperature gradeSFVC784-1Extended
XCZU3TCG-2SFVC784ISame device, industrial temperatureSFVC784-2Industrial
XCZU3TCG-2SFVC784ESame device, extended temperatureSFVC784-2Extended
XCZU3TCG-3SFVC784CSame device, different speed gradeSFVC784-3Commercial

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