XCZU39DR-3FFVF1760C
AMD XilinxZynq UltraScale+ RFSoCRFSoC
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU39DR-3FFVF1760C
- Base device
- XCZU39DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVF1760
- Package type
- BGA
- Pin / ball count
- 1,760
- Speed grade
- -3
- Temperature grade
- Commercial
Device specifications
- User I/O (FFVF1760)
- 414
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU39DR | Base Device | Zynq UltraScale+ RFSoC device XCZU39DR |
| 3 | Speed Grade | Speed grade 3 |
| FFVF1760 | Package | 1760-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU39DR-1FFVF1760C | Same device, different speed grade | FFVF1760 | -1 | Commercial |
| XCZU39DR-1FFVF1760I | Same device, different speed and temperature grade | FFVF1760 | -1 | Industrial |
| XCZU39DR-1FFVF1760E | Same device, different speed and temperature grade | FFVF1760 | -1 | Extended |
| XCZU39DR-2FFVF1760C | Same device, different speed grade | FFVF1760 | -2 | Commercial |
| XCZU39DR-2FFVF1760I | Same device, different speed and temperature grade | FFVF1760 | -2 | Industrial |
| XCZU39DR-2FFVF1760E | Same device, different speed and temperature grade | FFVF1760 | -2 | Extended |
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